Kyu Hyung LEE

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Gumi-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method of measuring depth of damage of wafer
- Patent number 9,857,319
- Issue date Jan 2, 2018
- LG SILTRON INCORPORATED
- Kyu Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MEASURING DEPTH OF DAMAGE OF WAFER
- Publication number 20160238544
- Publication date Aug 18, 2016
- LG SILTRON INCORPORATED
- Kyu Hyung LEE
- G01 - MEASURING TESTING