KYU-OH LEE

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrates, a semiconductor device and a method fo...
- Patent number 12,224,264
- Issue date Feb 11, 2025
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to selectively embed magnetic materials in substrate and co...
- Patent number 12,154,715
- Issue date Nov 26, 2024
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with embedded interconnects
- Patent number 11,942,406
- Issue date Mar 26, 2024
- Intel Corporation
- Kyu Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,935,805
- Issue date Mar 19, 2024
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,901,115
- Issue date Feb 13, 2024
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,862,552
- Issue date Jan 2, 2024
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrates, a semiconductor device and a method fo...
- Patent number 11,842,981
- Issue date Dec 12, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to embed magnetic material as first layer on coreless subst...
- Patent number 11,735,537
- Issue date Aug 22, 2023
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,664,290
- Issue date May 30, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors
- Patent number 11,651,885
- Issue date May 16, 2023
- Intel Corporation
- Junnan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Release layer-assisted selective embedding of magnetic material in...
- Patent number 11,610,706
- Issue date Mar 21, 2023
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to pattern TFC and incorporation in the ODI architecture an...
- Patent number 11,581,271
- Issue date Feb 14, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity structures in integrated circuit package supports
- Patent number 11,557,489
- Issue date Jan 17, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having a cooling channel
- Patent number 11,521,914
- Issue date Dec 6, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Effective heat conduction from hotspot to heat spreader through pac...
- Patent number 11,502,017
- Issue date Nov 15, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,482,471
- Issue date Oct 25, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to selectively embed magnetic materials in substrate and co...
- Patent number 11,450,471
- Issue date Sep 20, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,443,892
- Issue date Sep 13, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for attaching large components in a package substrate for a...
- Patent number 11,432,405
- Issue date Aug 30, 2022
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to embed magnetic material as first layer on coreless subst...
- Patent number 11,417,614
- Issue date Aug 16, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to incorporate thin film capacitor sheets (TFC-S) in the bu...
- Patent number 11,410,921
- Issue date Aug 9, 2022
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with embedded interconnects
- Patent number 11,393,745
- Issue date Jul 19, 2022
- Intel Corporation
- Kyu Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material in substrate cavity
- Patent number 11,387,224
- Issue date Jul 12, 2022
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,380,609
- Issue date Jul 5, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding magnetic material, in a cored or coreless semiconductor p...
- Patent number 11,355,459
- Issue date Jun 7, 2022
- INTEL CORPOATION
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for an inductor at a first level interface
- Patent number 11,322,290
- Issue date May 3, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package substrate formed with dielectric bi-layer
- Patent number 11,276,634
- Issue date Mar 15, 2022
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,251,113
- Issue date Feb 15, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a coaxial first layer interconnect
- Patent number 11,244,912
- Issue date Feb 8, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20240186202
- Publication date Jun 6, 2024
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...
- Publication number 20240063173
- Publication date Feb 22, 2024
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE SUBSTRATE HAVING A PASSIVE ELECTRONIC COMPONENT
- Publication number 20230317642
- Publication date Oct 5, 2023
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20230245940
- Publication date Aug 3, 2023
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MAGNETIC INDUCTOR AND METHOD
- Publication number 20230162902
- Publication date May 25, 2023
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTOR DEVICE AND METHOD
- Publication number 20230092492
- Publication date Mar 23, 2023
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD, AND SYSTEM TO PROVIDE PASSIVATION STRUCTURES OF A M...
- Publication number 20220406512
- Publication date Dec 22, 2022
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO SELECTIVELY EMBED MAGNETIC MATERIALS IN SUBSTRATE AND CO...
- Publication number 20220367104
- Publication date Nov 17, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE
- Publication number 20220359115
- Publication date Nov 10, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO EMBED MAGNETIC MATERIAL AS FIRST LAYER ON CORELESS SUBST...
- Publication number 20220328431
- Publication date Oct 13, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH EMBEDDED INTERCONNECTS
- Publication number 20220302005
- Publication date Sep 22, 2022
- Intel Corporation
- Kyu Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...
- Publication number 20220278038
- Publication date Sep 1, 2022
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
- Publication number 20220230800
- Publication date Jul 21, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF MET...
- Publication number 20220199503
- Publication date Jun 23, 2022
- Intel Corporation
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS FLI BUMPS FOR REDUCING BUMP THICKNESS VARIATION SENSITIVITY...
- Publication number 20220165695
- Publication date May 26, 2022
- Intel Corporation
- Numair AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES
- Publication number 20220130748
- Publication date Apr 28, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...
- Publication number 20210398941
- Publication date Dec 23, 2021
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20210391232
- Publication date Dec 16, 2021
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20210111088
- Publication date Apr 15, 2021
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH EMBEDDED INTERCONNECTS
- Publication number 20210082797
- Publication date Mar 18, 2021
- Intel Corporation
- Kyu Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE
- Publication number 20200373257
- Publication date Nov 26, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO PATTERN TFC AND INCORPORATION IN THE ODI ARCHITECTURE AN...
- Publication number 20200294938
- Publication date Sep 17, 2020
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200273776
- Publication date Aug 27, 2020
- Intel Corporation
- Cheng Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GALVANIC CORROSION PROTECTION FOR SEMICONDUCTOR PACKAGES
- Publication number 20200266149
- Publication date Aug 20, 2020
- Intel Corporation
- Cheng XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...
- Publication number 20200251467
- Publication date Aug 6, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL
- Publication number 20200211927
- Publication date Jul 2, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PAC...
- Publication number 20200185300
- Publication date Jun 11, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE INDUCTORS
- Publication number 20200168384
- Publication date May 28, 2020
- Intel Corporation
- Junnan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A COAXIAL FIRST LAYER INTERCONNECT
- Publication number 20200168569
- Publication date May 28, 2020
- Intel Corporation
- Sai VADLAMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY
- Publication number 20200118990
- Publication date Apr 16, 2020
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL

Person

Patents Grantslast 30 patents

Magnetic inductor device and method

Die interconnect substrates, a semiconductor device and a method fo...

Methods to selectively embed magnetic materials in substrate and co...

Semiconductor packages with embedded interconnects

Package with underfill containment barrier

Substrate assembly with encapsulated magnetic feature

Methods of embedding magnetic structures in substrates

Die interconnect substrates, a semiconductor device and a method fo...

Methods to embed magnetic material as first layer on coreless subst...

Package with underfill containment barrier

Magnetic core inductors

Release layer-assisted selective embedding of magnetic material in...

Methods to pattern TFC and incorporation in the ODI architecture an...

Cavity structures in integrated circuit package supports

Microelectronic assemblies having a cooling channel

Effective heat conduction from hotspot to heat spreader through pac...

Thermal management solutions for integrated circuit packages

Methods to selectively embed magnetic materials in substrate and co...

Substrate assembly with encapsulated magnetic feature

Methods for attaching large components in a package substrate for a...

Methods to embed magnetic material as first layer on coreless subst...

Methods to incorporate thin film capacitor sheets (TFC-S) in the bu...

Semiconductor packages with embedded interconnects

Phase change material in substrate cavity

Microelectronic assemblies having conductive structures with differ...

Embedding magnetic material, in a cored or coreless semiconductor p...

Techniques for an inductor at a first level interface

High density package substrate formed with dielectric bi-layer

Methods of embedding magnetic structures in substrates

Semiconductor package having a coaxial first layer interconnect

Patents Applicationslast 30 patents

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...

ELECTRONIC DEVICE SUBSTRATE HAVING A PASSIVE ELECTRONIC COMPONENT

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

STACKED MAGNETIC INDUCTOR AND METHOD

MAGNETIC INDUCTOR DEVICE AND METHOD

DEVICE, METHOD, AND SYSTEM TO PROVIDE PASSIVATION STRUCTURES OF A M...

METHODS TO SELECTIVELY EMBED MAGNETIC MATERIALS IN SUBSTRATE AND CO...

SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE

METHODS TO EMBED MAGNETIC MATERIAL AS FIRST LAYER ON CORELESS SUBST...

SEMICONDUCTOR PACKAGES WITH EMBEDDED INTERCONNECTS

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...

TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE

NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF MET...

POROUS FLI BUMPS FOR REDUCING BUMP THICKNESS VARIATION SENSITIVITY...

METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES

DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

SEMICONDUCTOR PACKAGES WITH EMBEDDED INTERCONNECTS

TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE

METHODS TO PATTERN TFC AND INCORPORATION IN THE ODI ARCHITECTURE AN...

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

GALVANIC CORROSION PROTECTION FOR SEMICONDUCTOR PACKAGES

PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...

MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL

EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PAC...

MAGNETIC CORE INDUCTORS

SEMICONDUCTOR PACKAGE HAVING A COAXIAL FIRST LAYER INTERCONNECT

PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY