Kyu-Pyung Hwang

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical module assembly with embedded dies
- Patent number 11,462,460
- Issue date Oct 4, 2022
- The Boeing Company
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for high-intensity radiated field (HIRF) and electromagnetic...
- Patent number 11,378,605
- Issue date Jul 5, 2022
- The Boeing Company
- Kyu-Pyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fire suppressing device
- Patent number 11,191,983
- Issue date Dec 7, 2021
- The Boeing Company
- Kyu-Pyung Hwang
- A62 - LIFE-SAVING FIRE-FIGHTING
Information Patent Grant
Methods of manufacturing a high impedance surface (HIS) enhanced by...
- Patent number 11,071,213
- Issue date Jul 20, 2021
- The Boeing Company
- Charles Muwonge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High impedance surface (HIS) enhanced by discrete passives
- Patent number 11,038,277
- Issue date Jun 15, 2021
- The Boeing Company
- Charles Muwonge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor having surface mounted trimming bridges for incr...
- Patent number 10,980,122
- Issue date Apr 13, 2021
- The Boeing Company
- Kyu-Pyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable radio frequency attenuator
- Patent number 10,903,542
- Issue date Jan 26, 2021
- The Boeing Company
- Walid M. Al-Bondak
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thin film resistor having surface mounted trimming bridges for incr...
- Patent number 10,653,013
- Issue date May 12, 2020
- The Boeing Company
- Kyu-Pyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package comprising surface capacitor and ground...
- Patent number 10,181,410
- Issue date Jan 15, 2019
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure for power delivery applications
- Patent number 10,079,097
- Issue date Sep 18, 2018
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package on package structure and method of forming th...
- Patent number 10,049,977
- Issue date Aug 14, 2018
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Known good die testing for high frequency applications
- Patent number 9,933,455
- Issue date Apr 3, 2018
- QUALCOMM Incorporated
- Young Kyu Song
- G01 - MEASURING TESTING
Information Patent Grant
Low profile reinforced package-on-package semiconductor device
- Patent number 9,875,997
- Issue date Jan 23, 2018
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure for wideband resonance suppression in power del...
- Patent number 9,837,209
- Issue date Dec 5, 2017
- QUALCOMM Incorporated
- Kyu-Pyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising embedded elongated capacitor
- Patent number 9,807,884
- Issue date Oct 31, 2017
- QUALCOMM Incorporated
- Kyu-Pyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate comprising capacitor, redistribution layer and di...
- Patent number 9,659,850
- Issue date May 23, 2017
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-terminal capacitor
- Patent number 9,628,052
- Issue date Apr 18, 2017
- QUALCOMM Incorporated
- Hong Bok We
- G05 - CONTROLLING REGULATING
Information Patent Grant
Integrated device package and/or system comprising configurable dir...
- Patent number 9,621,281
- Issue date Apr 11, 2017
- QUALCOMM Incorporated
- Kyu-Pyung Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Interposer for a package-on-package structure
- Patent number 9,613,942
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package comprising conductive sheet configured as...
- Patent number 9,583,433
- Issue date Feb 28, 2017
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package (PoP) device comprising a high performance inter...
- Patent number 9,530,739
- Issue date Dec 27, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package substrate capacitor
- Patent number 9,502,490
- Issue date Nov 22, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded sheet capacitor
- Patent number 9,502,491
- Issue date Nov 22, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising a heat-dissipation layer providing an...
- Patent number 9,490,226
- Issue date Nov 8, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution improvement using pseudo-ESR control of an embed...
- Patent number 9,472,425
- Issue date Oct 18, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package substrate capacitor with configurable/controllable...
- Patent number 9,449,762
- Issue date Sep 20, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated device package comprising an electromagnetic (EM) passiv...
- Patent number 9,425,143
- Issue date Aug 23, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising coaxial interconnect
- Patent number 9,385,077
- Issue date Jul 5, 2016
- QUALCOMM Incorporated
- Dong Wook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package interconnections and method of making the same
- Patent number 9,355,963
- Issue date May 31, 2016
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable magnetic probe for efficient near field scanning
- Patent number 9,335,384
- Issue date May 10, 2016
- QUALCOMM Incorporated
- Kyu-Pyung Hwang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR HIGH-INTENSITY RADIATED FIELD (HIRF) AND ELECTROMAGNETI...
- Publication number 20210215748
- Publication date Jul 15, 2021
- The Boeing Company
- Kyu-Pyung Hwang
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
THIN FILM RESISTOR HAVING SURFACE MOUNTED TRIMMING BRIDGES FOR INCR...
- Publication number 20210068256
- Publication date Mar 4, 2021
- The Boeing Company
- Kyu-Pyung Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MANUFACTURING A HIGH IMPEDANCE SURFACE (HIS) ENHANCED BY...
- Publication number 20210029836
- Publication date Jan 28, 2021
- The Boeing Company
- Charles Muwonge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH IMPEDANCE SURFACE (HIS) ENHANCED BY DISCRETE PASSIVES
- Publication number 20210028550
- Publication date Jan 28, 2021
- The Boeing Company
- Charles Muwonge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL MODULE ASSEMBLY WITH EMBEDDED DIES
- Publication number 20200388560
- Publication date Dec 10, 2020
- The Boeing Company
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRE SUPPRESSING DEVICE
- Publication number 20200147424
- Publication date May 14, 2020
- The Boeing Company
- Kyu-Pyung Hwang
- A62 - LIFE-SAVING FIRE-FIGHTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND...
- Publication number 20190057880
- Publication date Feb 21, 2019
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND...
- Publication number 20170125332
- Publication date May 4, 2017
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE FOR POWER DELIVERY APPLICATIONS
- Publication number 20160365196
- Publication date Dec 15, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR A PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20160358899
- Publication date Dec 8, 2016
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
KNOWN GOOD DIE TESTING FOR HIGH FREQUENCY APPLICATIONS
- Publication number 20160327590
- Publication date Nov 10, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING AN ELECTROMAGNETIC (EM) PASSIV...
- Publication number 20160322300
- Publication date Nov 3, 2016
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION IMPROVEMENT USING PSEUDO-ESR CONTROL OF AN EMBED...
- Publication number 20160276173
- Publication date Sep 22, 2016
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING CONDUCTIVE SHEET CONFIGURED AS...
- Publication number 20160247761
- Publication date Aug 25, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) STRUCTURE
- Publication number 20160225748
- Publication date Aug 4, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING AN EMBEDDED CAPACITOR
- Publication number 20160183379
- Publication date Jun 23, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE COMPRISING EMBEDDED ELONGATED CAPACITOR
- Publication number 20160183378
- Publication date Jun 23, 2016
- QUALCOMM Incorporated
- Kyu-Pyung HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR CONTROLLING EQUIVALENT SERIES RESISTANCE OF A CAPACITOR
- Publication number 20160183386
- Publication date Jun 23, 2016
- QUALCOMM Incorporated
- Young Kyu SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE ON PACKAGE (POP) DEVICE COMPRISING A HIGH PERFORMANCE INTER...
- Publication number 20160172302
- Publication date Jun 16, 2016
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE REINFORCED PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20160172344
- Publication date Jun 16, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING CAPACITOR, REDISTRIBUTION LAYER AND DI...
- Publication number 20160163628
- Publication date Jun 9, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE AND/OR SYSTEM COMPRISING CONFIGURABLE DIR...
- Publication number 20160142156
- Publication date May 19, 2016
- QUALCOMM Incorporated
- Kyu-Pyung Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN PHOTO IMAGEA...
- Publication number 20160141234
- Publication date May 19, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING AN ELECTROMAGNETIC (EM) PASSIV...
- Publication number 20160141244
- Publication date May 19, 2016
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INTERCONNECTIONS AND METHOD OF MAKING THE SAME
- Publication number 20160093571
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Dong Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE FILM ELECTRICAL-TEST SUBSTRATES WITH CONDUCTIVE COUPLING P...
- Publication number 20160091532
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL PACKAGE (WLP) INTEGRATED DEVICE COMPRISING ELECTROMAGNE...
- Publication number 20160056226
- Publication date Feb 25, 2016
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES INCLUDING EMBEDDED CAPACITORS
- Publication number 20160055976
- Publication date Feb 25, 2016
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING A HEAT-DISSIPATION LAYER PROVIDING AN...
- Publication number 20160049378
- Publication date Feb 18, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FISHBONE LC COMPONENT AND METHOD OF MAKING THE SAME
- Publication number 20160049458
- Publication date Feb 18, 2016
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS

Kyu-Pyung Hwang

Person

Patents Grantslast 30 patents

Electrical module assembly with embedded dies

Method for high-intensity radiated field (HIRF) and electromagnetic...

Fire suppressing device

Methods of manufacturing a high impedance surface (HIS) enhanced by...

High impedance surface (HIS) enhanced by discrete passives

Thin film resistor having surface mounted trimming bridges for incr...

Variable radio frequency attenuator

Thin film resistor having surface mounted trimming bridges for incr...

Integrated circuit package comprising surface capacitor and ground...

Capacitor structure for power delivery applications

Semiconductor package on package structure and method of forming th...

Known good die testing for high frequency applications

Low profile reinforced package-on-package semiconductor device

Capacitor structure for wideband resonance suppression in power del...

Substrate comprising embedded elongated capacitor

Package substrate comprising capacitor, redistribution layer and di...

Embedded multi-terminal capacitor

Integrated device package and/or system comprising configurable dir...

Interposer for a package-on-package structure

Integrated device package comprising conductive sheet configured as...

Package on package (PoP) device comprising a high performance inter...

Embedded package substrate capacitor

Embedded sheet capacitor

Integrated device comprising a heat-dissipation layer providing an...

Power distribution improvement using pseudo-ESR control of an embed...

Embedded package substrate capacitor with configurable/controllable...

Integrated device package comprising an electromagnetic (EM) passiv...

Integrated device comprising coaxial interconnect

Semiconductor package interconnections and method of making the same

Adjustable magnetic probe for efficient near field scanning

Patents Applicationslast 30 patents

METHOD FOR HIGH-INTENSITY RADIATED FIELD (HIRF) AND ELECTROMAGNETI...

THIN FILM RESISTOR HAVING SURFACE MOUNTED TRIMMING BRIDGES FOR INCR...

METHODS OF MANUFACTURING A HIGH IMPEDANCE SURFACE (HIS) ENHANCED BY...

HIGH IMPEDANCE SURFACE (HIS) ENHANCED BY DISCRETE PASSIVES

ELECTRICAL MODULE ASSEMBLY WITH EMBEDDED DIES

FIRE SUPPRESSING DEVICE

INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND...

INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND...

CAPACITOR STRUCTURE FOR POWER DELIVERY APPLICATIONS

INTERPOSER FOR A PACKAGE-ON-PACKAGE STRUCTURE

KNOWN GOOD DIE TESTING FOR HIGH FREQUENCY APPLICATIONS

INTEGRATED DEVICE PACKAGE COMPRISING AN ELECTROMAGNETIC (EM) PASSIV...

POWER DISTRIBUTION IMPROVEMENT USING PSEUDO-ESR CONTROL OF AN EMBED...

INTEGRATED DEVICE PACKAGE COMPRISING CONDUCTIVE SHEET CONFIGURED AS...

PACKAGE-ON-PACKAGE (POP) STRUCTURE

SUBSTRATE COMPRISING AN EMBEDDED CAPACITOR

SUBSTRATE COMPRISING EMBEDDED ELONGATED CAPACITOR

TECHNIQUES FOR CONTROLLING EQUIVALENT SERIES RESISTANCE OF A CAPACITOR

PACKAGE ON PACKAGE (POP) DEVICE COMPRISING A HIGH PERFORMANCE INTER...

LOW PROFILE REINFORCED PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE

PACKAGE SUBSTRATE COMPRISING CAPACITOR, REDISTRIBUTION LAYER AND DI...

INTEGRATED DEVICE PACKAGE AND/OR SYSTEM COMPRISING CONFIGURABLE DIR...

INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN PHOTO IMAGEA...

INTEGRATED DEVICE PACKAGE COMPRISING AN ELECTROMAGNETIC (EM) PASSIV...

SEMICONDUCTOR PACKAGE INTERCONNECTIONS AND METHOD OF MAKING THE SAME

FLEXIBLE FILM ELECTRICAL-TEST SUBSTRATES WITH CONDUCTIVE COUPLING P...

WAFER LEVEL PACKAGE (WLP) INTEGRATED DEVICE COMPRISING ELECTROMAGNE...

PACKAGE SUBSTRATES INCLUDING EMBEDDED CAPACITORS

INTEGRATED DEVICE COMPRISING A HEAT-DISSIPATION LAYER PROVIDING AN...

FISHBONE LC COMPONENT AND METHOD OF MAKING THE SAME