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Patents Grantslast 30 patents

Information Patent Grant
Methods for fabricating semiconductor packages by using a mold pres...
- Patent number 11,501,981
- Issue date Nov 15, 2022
- SK hynix Inc.
- Kyung Beom Seo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A DAM
- Publication number 20240304467
- Publication date Sep 12, 2024
- SK HYNIX INC.
- Kyung Beom SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE INCLUDING SEMICONDUCTOR DIES AND ENCAPSULANT
- Publication number 20240014175
- Publication date Jan 11, 2024
- SK HYNIX INC.
- Kyung Beom SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING SEMICONDUCTOR PACKAGES
- Publication number 20220115247
- Publication date Apr 14, 2022
- SK HYNIX INC.
- Kyung Beom SEO
- H01 - BASIC ELECTRIC ELEMENTS