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Kyung Jin Heo
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Suwon, KR
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Patents Grants
last 30 patents
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Patent Grant
Method for manufacturing printed circuit board
Patent number
9,005,456
Issue date
Apr 14, 2015
Samsung Electro-Mechanics Co., Ltd.
Kwang Sun You
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate structure and method of manufacturing the same
Patent number
8,759,986
Issue date
Jun 24, 2014
Samsung Electro-Mechanics Co., Ltd.
Chul Min Lee
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
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Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
Publication number
20140124474
Publication date
May 8, 2014
Samsung Electro-Mechanics Co., Ltd.
Kwang Sun You
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Substrate structure and method of manufacturing the same
Publication number
20120171432
Publication date
Jul 5, 2012
Samsung Electro-Mechanics Co., Ltd.
Chul Min Lee
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Electroless nickel plating solution composition, flexible printed c...
Publication number
20100155108
Publication date
Jun 24, 2010
Samsung Electro-Mechanics Co., Ltd.
Chul Min Lee
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of manufacturing printed circuit board for semiconductor pac...
Publication number
20080257742
Publication date
Oct 23, 2008
Samsung Electro-Mechanics Co., Ltd.
Yang Je Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR