Kyung-tae NA

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging apparatus formed from semiconductor package...
- Patent number 9,245,863
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Hae-jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, comprising a core insulation film
- Patent number 8,970,042
- Issue date Mar 3, 2015
- Samsung Electronics Co., Ltd.
- Bok-Sik Myung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICE-EMBEDDED PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDI...
- Publication number 20150022985
- Publication date Jan 22, 2015
- KYUNG-TAE NA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE APPARATUS
- Publication number 20140091463
- Publication date Apr 3, 2014
- Hae-jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board, Method for Fabricating the Same and Semiconductor Pa...
- Publication number 20130200531
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- Bok-Sik Myung
- H01 - BASIC ELECTRIC ELEMENTS