Kyung-Tae Wi

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Dicing film having shrinkage release film and method for manufactur...
- Patent number 8,101,527
- Issue date Jan 24, 2012
- LG Innotek Co. Ltd.
- Joon Mo Seo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing film having shrinkage release film and method of manufacturi...
- Patent number 7,968,977
- Issue date Jun 28, 2011
- LG Innotek Co., Ltd
- Joon Mo Seo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing die attachment film and method for packaging semiconductor u...
- Patent number 7,768,141
- Issue date Aug 3, 2010
- LG Innotek Co., Ltd
- Joon-Mo Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die adhesive film for semiconductor
- Patent number 7,485,494
- Issue date Feb 3, 2009
- LS Cable Ltd.
- Byoung-Un Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DICING FILM HAVING SHRINKAGE RELEASE FILM AND METHOD FOR MANUFACTUR...
- Publication number 20100197078
- Publication date Aug 5, 2010
- LG Cable Ltd.
- Joon Mo Seo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PACKAGING SEMICONDUCTOR
- Publication number 20100087067
- Publication date Apr 8, 2010
- Joon-Mo Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR
- Publication number 20090198013
- Publication date Aug 6, 2009
- Dong-Cheon Shin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING DIE ATTACHMENT FILM AND METHOD FOR PACKAGING SEMICONDUCTOR U...
- Publication number 20090091044
- Publication date Apr 9, 2009
- Joon-Mo Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-attaching paste composition and method for hardening the same
- Publication number 20070134847
- Publication date Jun 14, 2007
- Byoung-Un Kang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Dual printing mask for screen printing
- Publication number 20070101877
- Publication date May 10, 2007
- Joon-Mo Seo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Dicing die adhesive film for semiconductor
- Publication number 20060244132
- Publication date Nov 2, 2006
- Byoung-Un Kang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Dicing film having shrinkage release film and method of manufacturi...
- Publication number 20050215032
- Publication date Sep 29, 2005
- Joon Mo Seo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Kyung-Tae Wi

Person

Patents Grantslast 30 patents

Dicing film having shrinkage release film and method for manufactur...

Dicing film having shrinkage release film and method of manufacturi...

Dicing die attachment film and method for packaging semiconductor u...

Dicing die adhesive film for semiconductor

Patents Applicationslast 30 patents

DICING FILM HAVING SHRINKAGE RELEASE FILM AND METHOD FOR MANUFACTUR...

METHOD FOR PACKAGING SEMICONDUCTOR

ADHESIVE FILM FOR SEMICONDUCTOR

DICING DIE ATTACHMENT FILM AND METHOD FOR PACKAGING SEMICONDUCTOR U...

Die-attaching paste composition and method for hardening the same

Dual printing mask for screen printing

Dicing die adhesive film for semiconductor

Dicing film having shrinkage release film and method of manufacturi...