Kyung Taeg Han

Person

Hwasung-gun, KR

People

Patents Grantslast 30 patents

Information Patent Grant
High power light emitting diode package
- Patent number RE46851
- Issue date May 15, 2018
- Samsung Electronics Co., Ltd.
- Seon Goo Lee
Information Patent Grant
Light emitting diode package and fabrication method thereof
- Patent number 8,735,931
- Issue date May 27, 2014
- Samsung Electronics Co., Ltd.
- Kyung Taeg Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power light emitting diode package
- Patent number RE44811
- Issue date Mar 18, 2014
- Samsung Electronics Co., Ltd.
- Seon Goo Lee
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
AC detection circuit for power supply
- Patent number 8,441,270
- Issue date May 14, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Sung Uk Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
AC detection circuit for power supply
- Patent number 8,362,790
- Issue date Jan 29, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Sung Uk Lee
- G01 - MEASURING TESTING
Information Patent Grant
Chip coated light emitting diode package and manufacturing method t...
- Patent number 8,324,646
- Issue date Dec 4, 2012
- Samsung Electronics Co., Ltd.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package having recess in heat conducting part
- Patent number 8,169,128
- Issue date May 1, 2012
- Samsung LED Co., Ltd.
- Seon Goo Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Light emitting diode package and fabrication method thereof
- Patent number 8,168,453
- Issue date May 1, 2012
- Samsung LED Co., Ltd.
- Kyung Taeg Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power light emitting diode package
- Patent number RE43200
- Issue date Feb 21, 2012
- Samsung LED Co., Ltd.
- Seon Goo Lee
- 257 - Active solid-state devices
Information Patent Grant
Chip coated light emitting diode package and manufacturing method t...
- Patent number 8,013,352
- Issue date Sep 6, 2011
- Samsung LED Co., Ltd.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-type backlight unit having surface light source
- Patent number 7,887,225
- Issue date Feb 15, 2011
- Samsung LED Co., Ltd.
- Won Joon Lee
- G02 - OPTICS
Information Patent Grant
High power LED package and fabrication method thereof
- Patent number 7,875,476
- Issue date Jan 25, 2011
- Samsung LED Co., Ltd.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-emitting LED package and method of manufacturing the same
- Patent number 7,833,811
- Issue date Nov 16, 2010
- Samsung LED Co., Ltd.
- Kyung Taeg Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip coated light emitting diode package and manufacturing method t...
- Patent number 7,795,052
- Issue date Sep 14, 2010
- Samsung LED Co., Ltd.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package with diffuser and method of manufactur...
- Patent number 7,790,482
- Issue date Sep 7, 2010
- Samsung Led Co., Ltd.
- Seong Yeon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip coated light emitting diode package and manufacturing method t...
- Patent number 7,714,342
- Issue date May 11, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package with metal reflective layer and method...
- Patent number 7,687,292
- Issue date Mar 30, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jung Kyu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED housing and fabrication method thereof
- Patent number 7,678,592
- Issue date Mar 16, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power LED package and fabrication method thereof
- Patent number 7,626,250
- Issue date Dec 1, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package with diffuser and method of manufactur...
- Patent number 7,501,656
- Issue date Mar 10, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Seong Yeon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-view light emitting diode having protective device
- Patent number 7,462,871
- Issue date Dec 9, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Taeg Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package having dual lens structure for lateral...
- Patent number 7,458,703
- Issue date Dec 2, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Taeg Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-emitting LED package and manufacturing method of the same
- Patent number 7,338,823
- Issue date Mar 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Taeg Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Orthogonal frequency division multiplexing/modulation communication...
- Patent number 7,269,782
- Issue date Sep 11, 2007
- TeleCIS Wireless, Inc.
- Je-Woo Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High power light emitting diode package
- Patent number 7,208,772
- Issue date Apr 24, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package for backlight unit
- Patent number 7,156,538
- Issue date Jan 2, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Taeg Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full-color light emitting device with four leads
- Patent number 7,102,283
- Issue date Sep 5, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Yong Chil Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Orthogonal frequency division multiplexing/modulation communication...
- Patent number 7,028,246
- Issue date Apr 11, 2006
- Telecis Technologies,Inc.
- Je-Woo Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Light-emitting diode
- Patent number D512694
- Issue date Dec 13, 2005
- Samsung Electro-Mechanics Co., Ltd.
- Chang Wook Kim
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Light-emitting diode
- Patent number D512029
- Issue date Nov 29, 2005
- Samsung Electro-Mechanics Co., Ltd.
- Chang Wook Kim
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110031526
- Publication date Feb 10, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyung Taeg Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20100289051
- Publication date Nov 18, 2010
- Samsung LED Co., Ltd.
- Seon Goo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20100109040
- Publication date May 6, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seon Goo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20100112735
- Publication date May 6, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seon Goo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER LED PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20100047941
- Publication date Feb 25, 2010
- SAMSUNG ELECTO-MECHANICS CO., LTD.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20090197360
- Publication date Aug 6, 2009
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyung Taeg HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE WITH DIFFUSER AND METHOD OF MANUFACTUR...
- Publication number 20090155938
- Publication date Jun 18, 2009
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Yeon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Side-emitting LED package and method of manufacturing the same
- Publication number 20080254558
- Publication date Oct 16, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Taeg Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light emitting diode package with metal reflective layer and method...
- Publication number 20080233666
- Publication date Sep 25, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jung Kyu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Side-emitting LED package and manufacturing method of the same
- Publication number 20080128736
- Publication date Jun 5, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Taeg Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct-type backlight unit having surface light source
- Publication number 20080007939
- Publication date Jan 10, 2008
- Samsung Electro-Mechanics CO., LTD.
- Won Joon Lee
- G02 - OPTICS
Information Patent Application
Light emitting diode package and fabrication method thereof
- Publication number 20070241362
- Publication date Oct 18, 2007
- Samsung Electro-Mechanics CO., LTD.
- Kyung Taeg Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip coated light emitting diode package and manufacturing method t...
- Publication number 20070158669
- Publication date Jul 12, 2007
- Samsung Electro-Mechanics CO., LTD.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED HOUSING AND FABRICATION METHOD THEREOF
- Publication number 20070145387
- Publication date Jun 28, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Seon Goo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light emitting diode package with diffuser and method of manufactur...
- Publication number 20070045644
- Publication date Mar 1, 2007
- Samsung Electro-Mechanics CO., LTD.
- Seong Yeon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Side-view light emitting diode having protective device
- Publication number 20070029564
- Publication date Feb 8, 2007
- Samsung Elecro-Mechanics Co., Ltd.
- Kyung Taeg Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED having improved soldering structure, method for soldering the L...
- Publication number 20070029572
- Publication date Feb 8, 2007
- Samsung Electro-Mechanics CO., LTD.
- Kyung Taeg Han
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LED package having recess in heat conducting part
- Publication number 20070030703
- Publication date Feb 8, 2007
- Samsung Electro-Mechanics CO., LTD.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light emitting diode package having dual lens structure for lateral...
- Publication number 20070019416
- Publication date Jan 25, 2007
- Samsung Electro-Mechanics CO., LTD.
- Kyung Taeg Han
- G02 - OPTICS
Information Patent Application
Side-emitting LED package and manufacturing method of the same
- Publication number 20060284203
- Publication date Dec 21, 2006
- SUMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyung Taeg Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light emitting diode package with metal reflective layer and method...
- Publication number 20060284207
- Publication date Dec 21, 2006
- Samsung Electro-Mechanics CO., LTD.
- Jung Kyu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Side-emitting LED package and method of manufacturing the same
- Publication number 20060273337
- Publication date Dec 7, 2006
- Samsung Electro-Mechanics CO., LTD.
- Kyung Taeg Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High power LED package and fabrication method thereof
- Publication number 20060273338
- Publication date Dec 7, 2006
- Samsung Electro-Mechanics CO., LTD.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED housing and fabrication method thereof
- Publication number 20060180925
- Publication date Aug 17, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Orthogonal frequency division multiplexing/modulation communication...
- Publication number 20060184862
- Publication date Aug 17, 2006
- Je-Woo Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
High power light emitting diode package
- Publication number 20060043401
- Publication date Mar 2, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED package for backlight unit
- Publication number 20060023451
- Publication date Feb 2, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Taeg Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED lamp having heat dissipating portion
- Publication number 20050110027
- Publication date May 26, 2005
- Seung Mo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Full-color light emitting device with four leads
- Publication number 20040264184
- Publication date Dec 30, 2004
- Yong Chil Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Orthogonal frequency division multiplexing/modulation communication...
- Publication number 20020172184
- Publication date Nov 21, 2002
- Je-Woo Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Kyung Taeg Han

Person

Patents Grantslast 30 patents

High power light emitting diode package

Light emitting diode package and fabrication method thereof

High power light emitting diode package

AC detection circuit for power supply

AC detection circuit for power supply

Chip coated light emitting diode package and manufacturing method t...

LED package having recess in heat conducting part

Light emitting diode package and fabrication method thereof

High power light emitting diode package

Chip coated light emitting diode package and manufacturing method t...

Direct-type backlight unit having surface light source

High power LED package and fabrication method thereof

Side-emitting LED package and method of manufacturing the same

Chip coated light emitting diode package and manufacturing method t...

Light emitting diode package with diffuser and method of manufactur...

Chip coated light emitting diode package and manufacturing method t...

Light emitting diode package with metal reflective layer and method...

LED housing and fabrication method thereof

High power LED package and fabrication method thereof

Light emitting diode package with diffuser and method of manufactur...

Side-view light emitting diode having protective device

Light emitting diode package having dual lens structure for lateral...

Side-emitting LED package and manufacturing method of the same

Orthogonal frequency division multiplexing/modulation communication...

High power light emitting diode package

LED package for backlight unit

Full-color light emitting device with four leads

Orthogonal frequency division multiplexing/modulation communication...

Light-emitting diode

Light-emitting diode

Patents Applicationslast 30 patents

LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF

CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD T...

CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD T...

CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD T...

HIGH POWER LED PACKAGE AND FABRICATION METHOD THEREOF

LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF

LIGHT EMITTING DIODE PACKAGE WITH DIFFUSER AND METHOD OF MANUFACTUR...

Side-emitting LED package and method of manufacturing the same

Light emitting diode package with metal reflective layer and method...

Side-emitting LED package and manufacturing method of the same

Direct-type backlight unit having surface light source

Light emitting diode package and fabrication method thereof

Chip coated light emitting diode package and manufacturing method t...

LED HOUSING AND FABRICATION METHOD THEREOF

Light emitting diode package with diffuser and method of manufactur...

Side-view light emitting diode having protective device

LED having improved soldering structure, method for soldering the L...

LED package having recess in heat conducting part

Light emitting diode package having dual lens structure for lateral...

Side-emitting LED package and manufacturing method of the same

Light emitting diode package with metal reflective layer and method...

Side-emitting LED package and method of manufacturing the same

High power LED package and fabrication method thereof

LED housing and fabrication method thereof

Orthogonal frequency division multiplexing/modulation communication...

High power light emitting diode package

LED package for backlight unit

LED lamp having heat dissipating portion

Full-color light emitting device with four leads

Orthogonal frequency division multiplexing/modulation communication...