Kyung Wook Paik

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Daejon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor chip package having external terminal pads an...
- Patent number 6,188,129
- Issue date Feb 13, 2001
- Hyundai Electronics Industries Co., Ltd.
- Kyung Wook Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making stackable semiconductor chips to build a stacked c...
- Patent number 6,124,149
- Issue date Sep 26, 2000
- Hyundai Electronics Industries Co., Ltd.
- Kyung Wook Paik
- H01 - BASIC ELECTRIC ELEMENTS