Kyung-Wook Paik

Person

Yuseong-gu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of uniformly dispersing nickel-plated conductive particles o...
- Patent number 11,472,933
- Issue date Oct 18, 2022
- Korea Advanced Institute of Science and Technology
- Kyung Wook Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film and non-conductive paste including zinc particl...
- Patent number 9,376,541
- Issue date Jun 28, 2016
- Samsung Electronics Co., Ltd.
- Un-byoung Kang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Biaxial-optical polynorbornene-based film and method of manufacturi...
- Patent number 8,801,978
- Issue date Aug 12, 2014
- LG Chem, Ltd.
- Won Kook Kim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fiber, fiber aggregate and adhesive having the same
- Patent number 8,486,318
- Issue date Jul 16, 2013
- Optopac Co., Ltd.
- Deok Hoon Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Biaxial-optical polynorbornene-based film and method of manufacturi...
- Patent number 8,440,117
- Issue date May 14, 2013
- LG Chem, Ltd.
- Won Kook Kim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for producing norbornene monomer composition, norbornene pol...
- Patent number 7,989,571
- Issue date Aug 2, 2011
- LG Chem, Ltd.
- Sung-Ho Chun
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Catalyst system for polymerizing cyclic olefin having polar functio...
- Patent number 7,814,713
- Issue date Oct 19, 2010
- LG Chem, Ltd.
- Sung Cheol Yoon
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Catalyst system for polymerizing cyclic olefin having polar functio...
- Patent number 7,648,937
- Issue date Jan 19, 2010
- LG Chem, Ltd.
- Sung Cheol Yoon
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Biaxial-optical polynorbornene-based film and method of manufacturi...
- Patent number 7,582,339
- Issue date Sep 1, 2009
- LG Chem, Ltd.
- Won Kook Kim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
CMOS image sensor module with wafers
- Patent number 7,446,384
- Issue date Nov 4, 2008
- Korea Advanced Institute of Science and Technology
- Kyung-Wook Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nobonene-ester based addition polymer and method for preparing the...
- Patent number 7,442,752
- Issue date Oct 28, 2008
- LG Chem, Ltd.
- Sung-Ho Chun
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymer/ceramic composite paste for embedded capacitor and method f...
- Patent number 7,381,468
- Issue date Jun 3, 2008
- Korea Advanced Institute of Science and Technology
- Kyung Wook Paik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability non-conductive adhesives for non-solder flip chip...
- Patent number 6,930,399
- Issue date Aug 16, 2005
- KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Kyung-Wook Paik
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
High adhesion triple layered anisotropic conductive adhesive film
- Patent number 6,878,435
- Issue date Apr 12, 2005
- Korea Advanced Institute of Science and Technology
- Kyung wook Paik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing conductive adhesive for high frequency fli...
- Patent number 6,514,560
- Issue date Feb 4, 2003
- Korea Advanced Institute of Science and Technology
- Kyung wook Paik
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for forming flip chip bump and UBM for high speed copper int...
- Patent number 6,362,090
- Issue date Mar 26, 2002
- Korea Advanced Institute of Science and Technology
- Kyung Wook Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation method of anisotropic conductive adhesive for flip chip...
- Patent number 6,238,597
- Issue date May 29, 2001
- KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating chip size packages using lamination process
- Patent number 5,879,964
- Issue date Mar 9, 1999
- Korea Advanced Institute of Science and Technology
- Kyung Wook Paik
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COLORING AGENT COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, PHOTO...
- Publication number 20220413381
- Publication date Dec 29, 2022
- LG CHEM, LTD.
- Dami LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
NON-CONDUCTIVE FILM AND NON-CONDUCTIVE PASTE INCLUDING ZINC PARTICL...
- Publication number 20150102485
- Publication date Apr 16, 2015
- Korea Advanced Institute of Science and Technology
- Un-byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIAXIAL-OPTICAL POLYNORBORNENE-BASED FILM AND MTEHOD OF MANUFACTURI...
- Publication number 20130334718
- Publication date Dec 19, 2013
- LG CHEM, LTD.
- Won Kook KIM
- G02 - OPTICS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20130118672
- Publication date May 16, 2013
- Korea Advanced Institute of Science and Technology
- Ho Joon Park
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME
- Publication number 20120231689
- Publication date Sep 13, 2012
- OPTOPAC CO., LTD.
- Deok Hoon KIM
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME
- Publication number 20120231260
- Publication date Sep 13, 2012
- OPTOPAC CO., LTD.
- Deok Hoon KIM
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME
- Publication number 20120228805
- Publication date Sep 13, 2012
- OPTOPAC CO., LTD.
- Deok Hoon KIM
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...
- Publication number 20120118480
- Publication date May 17, 2012
- Kyung-Wook PAIK
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Catalyst system for polymerizing cyclic olefin having polar functio...
- Publication number 20100174039
- Publication date Jul 8, 2010
- Sung Cheol Yoon
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Biaxial-optical polynorbornene-based film and method of manufacturi...
- Publication number 20090295000
- Publication date Dec 3, 2009
- Won Kook Kim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of producing cyclic olefin polymers having polar functional...
- Publication number 20090192277
- Publication date Jul 30, 2009
- Sung Cheol Yoon
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Fabrication method of an organic substrate having embedded active-c...
- Publication number 20090042336
- Publication date Feb 12, 2009
- Kyung-Wook Paik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL ACA FLIP CHIP PACKAGE USING DOUBLE-LAYERED ACA/NCA
- Publication number 20090029504
- Publication date Jan 29, 2009
- Korea Advanced Institute of Science and Technology
- Kyung-Wook PAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING NORBORNENE MONOMER COMPOSITION, NORBORNENE POL...
- Publication number 20080319157
- Publication date Dec 25, 2008
- LG CHEM, LTD.
- Sung-Ho CHUN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING WAFER-LEVEL PACKAGES FOR FLIP CHIPS CAPABL...
- Publication number 20070259515
- Publication date Nov 8, 2007
- Korea Advanced Institute of Science and Technology
- Kyung-Wook Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level chip size package for CMOS image sensor module and manu...
- Publication number 20070054419
- Publication date Mar 8, 2007
- Kyung-Wook Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module and method thereof
- Publication number 20060252246
- Publication date Nov 9, 2006
- Kyung-Wook Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Biaxial-optical polynorbornene-based film and method of manufacturi...
- Publication number 20060105117
- Publication date May 18, 2006
- Won Kook Kim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Catalyst system for polymerizing cyclic olefin having polar functio...
- Publication number 20060058477
- Publication date Mar 16, 2006
- Sung Cheol Yoon
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polymer/ceramic composite paste for embedded capacitor and method f...
- Publication number 20050080175
- Publication date Apr 14, 2005
- Korea Advanced Institute of Science and Technology
- Kyung Wook Paik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Nobonene-ester based addition polymer and method for preparing the...
- Publication number 20050010006
- Publication date Jan 13, 2005
- Sung-Ho Chun
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
High reliability non-conductive adhesives for non-solder flip chip...
- Publication number 20030143797
- Publication date Jul 31, 2003
- Kyung-Wook Paik
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
High adhesion triple layered anisotropic conductive adhesive film
- Publication number 20030017327
- Publication date Jan 23, 2003
- Korea Advanced Institute of Science and Technology
- Kyung Wook Paik
- B32 - LAYERED PRODUCTS
Information Patent Application
Anisotropic conductive film and method of fabricating the same for...
- Publication number 20030008133
- Publication date Jan 9, 2003
- Korea Advanced Institute of Science and Technology
- Kyung wook Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing conductive adhesive for high frequency fli...
- Publication number 20020111423
- Publication date Aug 15, 2002
- Korea Advanced Institute of Science and Technology
- Kyung wook Paik
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Kyung-Wook Paik

Person

Patents Grantslast 30 patents

Method of uniformly dispersing nickel-plated conductive particles o...

Non-conductive film and non-conductive paste including zinc particl...

Biaxial-optical polynorbornene-based film and method of manufacturi...

Fiber, fiber aggregate and adhesive having the same

Biaxial-optical polynorbornene-based film and method of manufacturi...

Method for producing norbornene monomer composition, norbornene pol...

Catalyst system for polymerizing cyclic olefin having polar functio...

Catalyst system for polymerizing cyclic olefin having polar functio...

Biaxial-optical polynorbornene-based film and method of manufacturi...

CMOS image sensor module with wafers

Nobonene-ester based addition polymer and method for preparing the...

Polymer/ceramic composite paste for embedded capacitor and method f...

High reliability non-conductive adhesives for non-solder flip chip...

High adhesion triple layered anisotropic conductive adhesive film

Method for manufacturing conductive adhesive for high frequency fli...

Method for forming flip chip bump and UBM for high speed copper int...

Preparation method of anisotropic conductive adhesive for flip chip...

Method for fabricating chip size packages using lamination process

Patents Applicationslast 30 patents

COLORING AGENT COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, PHOTO...

NON-CONDUCTIVE FILM AND NON-CONDUCTIVE PASTE INCLUDING ZINC PARTICL...

BIAXIAL-OPTICAL POLYNORBORNENE-BASED FILM AND MTEHOD OF MANUFACTURI...

SUBSTRATE BONDING METHOD

FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME

FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME

FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME

ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...

Catalyst system for polymerizing cyclic olefin having polar functio...

Biaxial-optical polynorbornene-based film and method of manufacturi...

Method of producing cyclic olefin polymers having polar functional...

Fabrication method of an organic substrate having embedded active-c...

WAFER-LEVEL ACA FLIP CHIP PACKAGE USING DOUBLE-LAYERED ACA/NCA

METHOD FOR PRODUCING NORBORNENE MONOMER COMPOSITION, NORBORNENE POL...

METHOD FOR MANUFACTURING WAFER-LEVEL PACKAGES FOR FLIP CHIPS CAPABL...

Wafer level chip size package for CMOS image sensor module and manu...

Image sensor module and method thereof

Biaxial-optical polynorbornene-based film and method of manufacturi...

Catalyst system for polymerizing cyclic olefin having polar functio...

Polymer/ceramic composite paste for embedded capacitor and method f...

Nobonene-ester based addition polymer and method for preparing the...

High reliability non-conductive adhesives for non-solder flip chip...

High adhesion triple layered anisotropic conductive adhesive film

Anisotropic conductive film and method of fabricating the same for...

Method for manufacturing conductive adhesive for high frequency fli...