Kyungdon MUN

Person

  • Hwaseong-si, KR

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

    • Publication number 20240332157
    • Publication date Oct 3, 2024
    • Samsung Electronics Co., Ltd.
    • Sangjin Baek
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20240321839
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Kyungdon Mun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE

    • Publication number 20240136250
    • Publication date Apr 25, 2024
    • Samsung Electronics Co., Ltd.
    • Yeonho Jang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20240120280
    • Publication date Apr 11, 2024
    • Samsung Electronics Co., Ltd.
    • Kyungdon Mun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20240063193
    • Publication date Feb 22, 2024
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20240032310
    • Publication date Jan 25, 2024
    • Samsung Electronics Co., Ltd.
    • Kyungdon Mun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR CHIP STACK STRUCTURE, SEMICONDUCTOR PACKAGE, AND METH...

    • Publication number 20240032312
    • Publication date Jan 25, 2024
    • Samsung Electronics Co., Ltd.
    • Taeyoung LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

    • Publication number 20240021579
    • Publication date Jan 18, 2024
    • Samsung Electronics Co., Ltd.
    • Kyungdon Mun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20240006262
    • Publication date Jan 4, 2024
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20230230917
    • Publication date Jul 20, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20230197553
    • Publication date Jun 22, 2023
    • Samsung Electronics Co., Ltd.
    • KYUNGDON MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES

    • Publication number 20230187399
    • Publication date Jun 15, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20230178492
    • Publication date Jun 8, 2023
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20220254725
    • Publication date Aug 11, 2022
    • Samsung Electronics Co., Ltd.
    • Sangkyu LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

    • Publication number 20220199520
    • Publication date Jun 23, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20220068822
    • Publication date Mar 3, 2022
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20220052006
    • Publication date Feb 17, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20210265251
    • Publication date Aug 26, 2021
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20210233859
    • Publication date Jul 29, 2021
    • Samsung Electronics Co., Ltd.
    • Sangkyu LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20210210427
    • Publication date Jul 8, 2021
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20210210414
    • Publication date Jul 8, 2021
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS