KyungEun Kim

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Kyounggi-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with heat slug and method of ma...
- Patent number 8,710,640
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SLUG AND METHOD OF MA...
- Publication number 20130154078
- Publication date Jun 20, 2013
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sloped Surface in Patter...
- Publication number 20130113118
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS