KyungHoon Lee

Person

Kyunggi-Do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of using partial wafer singulation...
- Patent number 10,665,534
- Issue date May 26, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming dummy pillars between se...
- Patent number 10,096,540
- Issue date Oct 9, 2018
- STATS ChipPAC Pte. Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming WLCSP with semiconductor...
- Patent number 10,068,877
- Issue date Sep 4, 2018
- STATS ChipPAC Pte. Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using partial wafer singulation...
- Patent number 9,799,590
- Issue date Oct 24, 2017
- STATS ChipPAC Pte. Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming holes in substrate to in...
- Patent number 9,543,258
- Issue date Jan 10, 2017
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming topside and bottom-side...
- Patent number 9,478,486
- Issue date Oct 25, 2016
- STATS ChipPAC Pte. Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming reduced surface roughnes...
- Patent number 9,460,972
- Issue date Oct 4, 2016
- STATS ChipPAC Pte. Ltd.
- SeongWon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of backgrinding and singulation of...
- Patent number 9,401,289
- Issue date Jul 26, 2016
- STATS ChipPAC Pte. Ltd.
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of depositing underfill material wi...
- Patent number 9,390,945
- Issue date Jul 12, 2016
- STATS ChipPAC Pte. Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of mounting cover to semiconductor...
- Patent number 9,378,983
- Issue date Jun 28, 2016
- STATS ChipPAC Pte. Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming WLCSP with semiconductor...
- Patent number 9,349,616
- Issue date May 24, 2016
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming holes in substrate to in...
- Patent number 9,293,349
- Issue date Mar 22, 2016
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive protrusion ov...
- Patent number 9,230,933
- Issue date Jan 5, 2016
- STATS ChipPAC, Ltd.
- JaeHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with connection structure and m...
- Patent number 9,202,715
- Issue date Dec 1, 2015
- Stats Chippac Ltd.
- YoungChul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming non-linear interconnect...
- Patent number 9,117,812
- Issue date Aug 25, 2015
- STATS ChipPAC, Ltd.
- JaeHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with underfill and method of ma...
- Patent number 9,053,953
- Issue date Jun 9, 2015
- Stats Chippac Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming adjacent channel and dam...
- Patent number 9,030,030
- Issue date May 12, 2015
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming topside and bottom-side...
- Patent number 8,900,921
- Issue date Dec 2, 2014
- STATS ChipPAC, Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming uniform height insulatin...
- Patent number 8,877,567
- Issue date Nov 4, 2014
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with conductive pillars and mol...
- Patent number 8,853,855
- Issue date Oct 7, 2014
- Stats Chippac Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a thermally reinforced s...
- Patent number 8,786,076
- Issue date Jul 22, 2014
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system having warpage prevention struc...
- Patent number 8,723,310
- Issue date May 13, 2014
- Stats Chippac Ltd.
- YiSu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming non-linear interconnect...
- Patent number 8,642,384
- Issue date Feb 4, 2014
- STATS ChipPAC, Ltd.
- JaeHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of mounting cover to semiconductor...
- Patent number 8,476,115
- Issue date Jul 2, 2013
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with underfill and methods of m...
- Patent number 8,421,201
- Issue date Apr 16, 2013
- Stats Chippac Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming adjacent channel and DAM...
- Patent number 8,399,300
- Issue date Mar 19, 2013
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming holes in substrate to in...
- Patent number 8,264,059
- Issue date Sep 11, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system flip chip
- Patent number 8,143,096
- Issue date Mar 27, 2012
- Stats Chippac Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package system
- Patent number 7,956,449
- Issue date Jun 7, 2011
- Stats Chippac Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming holes in substrate to in...
- Patent number 7,906,371
- Issue date Mar 15, 2011
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Using Partial Wafer Singulation...
- Publication number 20180019195
- Publication date Jan 18, 2018
- STATS ChipPAC Pte Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming WLCSP with Semiconductor...
- Publication number 20160218089
- Publication date Jul 28, 2016
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Holes in Substrate to In...
- Publication number 20160148882
- Publication date May 26, 2016
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming WLCSP with Semiconductor...
- Publication number 20140264905
- Publication date Sep 18, 2014
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using Partial Wafer Singulation...
- Publication number 20140264817
- Publication date Sep 18, 2014
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Topside and Bottom-side...
- Publication number 20140239509
- Publication date Aug 28, 2014
- STATS ChipPAC, Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Non-Linear Interconnect...
- Publication number 20140103503
- Publication date Apr 17, 2014
- STATS ChipPAC, Ltd.
- JaeHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE PREVENTION MECHANI...
- Publication number 20130334714
- Publication date Dec 19, 2013
- YiSu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSIST AND METHOD OF...
- Publication number 20130328220
- Publication date Dec 12, 2013
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Backgrinding and Singulation of...
- Publication number 20130320519
- Publication date Dec 5, 2013
- STATS ChipPAC, Ltd.
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Depositing Underfill Material Wi...
- Publication number 20130299995
- Publication date Nov 14, 2013
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MOL...
- Publication number 20130241053
- Publication date Sep 19, 2013
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Mounting Cover to Semiconductor...
- Publication number 20130241039
- Publication date Sep 19, 2013
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Non-Linear Interconnect...
- Publication number 20130234318
- Publication date Sep 12, 2013
- STATS ChipPAC, Ltd.
- JaeHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Reduced Surface Roughnes...
- Publication number 20130175701
- Publication date Jul 11, 2013
- STATS ChipPAC, Ltd.
- SeongWon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Adjacent Channel and Dam...
- Publication number 20130147065
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Protrusions O...
- Publication number 20130069221
- Publication date Mar 21, 2013
- STATS ChipPAC, Ltd.
- JaeHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Holes in Substrate to In...
- Publication number 20120292751
- Publication date Nov 22, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Dummy Pillars Between Se...
- Publication number 20120286418
- Publication date Nov 15, 2012
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Mounting Cover to Semiconductor...
- Publication number 20120280374
- Publication date Nov 8, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Thermally Reinforced S...
- Publication number 20120241941
- Publication date Sep 27, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Uniform Height Insulatin...
- Publication number 20120126395
- Publication date May 24, 2012
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONNECTION STRUCTURE AND M...
- Publication number 20120119360
- Publication date May 17, 2012
- YoungChul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Adjacent Channel and DAM...
- Publication number 20110260338
- Publication date Oct 27, 2011
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Holes In Substrate to In...
- Publication number 20110121432
- Publication date May 26, 2011
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MA...
- Publication number 20100320587
- Publication date Dec 23, 2010
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Topside and Bottom-side...
- Publication number 20100148316
- Publication date Jun 17, 2010
- STATS ChipPAC, Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM FLIP CHIP
- Publication number 20100044882
- Publication date Feb 25, 2010
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20090321907
- Publication date Dec 31, 2009
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Holes In Substrate to In...
- Publication number 20090294928
- Publication date Dec 3, 2009
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS

KyungHoon Lee

Person

Patents Grantslast 30 patents

Semiconductor device and method of using partial wafer singulation...

Semiconductor device and method of forming dummy pillars between se...

Semiconductor device and method of forming WLCSP with semiconductor...

Semiconductor device and method of using partial wafer singulation...

Semiconductor device and method of forming holes in substrate to in...

Semiconductor device and method of forming topside and bottom-side...

Semiconductor device and method of forming reduced surface roughnes...

Semiconductor device and method of backgrinding and singulation of...

Semiconductor device and method of depositing underfill material wi...

Semiconductor device and method of mounting cover to semiconductor...

Semiconductor device and method of forming WLCSP with semiconductor...

Semiconductor device and method of forming holes in substrate to in...

Semiconductor device and method of forming conductive protrusion ov...

Integrated circuit packaging system with connection structure and m...

Semiconductor device and method of forming non-linear interconnect...

Integrated circuit packaging system with underfill and method of ma...

Semiconductor device and method of forming adjacent channel and dam...

Semiconductor device and method of forming topside and bottom-side...

Semiconductor device and method of forming uniform height insulatin...

Integrated circuit packaging system with conductive pillars and mol...

Semiconductor device and method of forming a thermally reinforced s...

Integrated circuit packaging system having warpage prevention struc...

Semiconductor device and method of forming non-linear interconnect...

Semiconductor device and method of mounting cover to semiconductor...

Integrated circuit packaging system with underfill and methods of m...

Semiconductor device and method of forming adjacent channel and DAM...

Semiconductor device and method of forming holes in substrate to in...

Integrated circuit package system flip chip

Stacked integrated circuit package system

Semiconductor device and method of forming holes in substrate to in...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Using Partial Wafer Singulation...

Semiconductor Device and Method of Forming WLCSP with Semiconductor...

Semiconductor Device and Method of Forming Holes in Substrate to In...

Semiconductor Device and Method of Forming WLCSP with Semiconductor...

Semiconductor Device and Method of Using Partial Wafer Singulation...

Semiconductor Device and Method of Forming Topside and Bottom-side...

Semiconductor Device and Method of Forming Non-Linear Interconnect...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE PREVENTION MECHANI...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSIST AND METHOD OF...

Semiconductor Device and Method of Backgrinding and Singulation of...

Semiconductor Device and Method of Depositing Underfill Material Wi...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MOL...

Semiconductor Device and Method of Mounting Cover to Semiconductor...

Semiconductor Device and Method of Forming Non-Linear Interconnect...

Semiconductor Device and Method of Forming Reduced Surface Roughnes...

Semiconductor Device and Method of Forming Adjacent Channel and Dam...

Semiconductor Device and Method of Forming Conductive Protrusions O...

Semiconductor Device and Method of Forming Holes in Substrate to In...

Semiconductor Device and Method of Forming Dummy Pillars Between Se...

Semiconductor Device and Method of Mounting Cover to Semiconductor...

Semiconductor Device and Method of Forming a Thermally Reinforced S...

Semiconductor Device and Method of Forming Uniform Height Insulatin...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONNECTION STRUCTURE AND M...

Semiconductor Device and Method of Forming Adjacent Channel and DAM...

Semiconductor Device and Method of Forming Holes In Substrate to In...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MA...

Semiconductor Device and Method of Forming Topside and Bottom-side...

INTEGRATED CIRCUIT PACKAGE SYSTEM FLIP CHIP

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

Semiconductor Device and Method of Forming Holes In Substrate to In...