KyungMoon Kim

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device, method for providing personal information using...
- Patent number 11,797,711
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Jaeyoung Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nonvolatile memory device and memory system including nonvolatile m...
- Patent number 11,164,636
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Sunyeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device and memory system including nonvolatile m...
- Patent number 10,699,789
- Issue date Jun 30, 2020
- Samsung Electronics Co., Ltd.
- Sunyeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming partition fence and shie...
- Patent number 10,418,332
- Issue date Sep 17, 2019
- STATS ChipPAC Pte. Ltd.
- Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive and insulating layers
- Patent number 9,865,575
- Issue date Jan 9, 2018
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of bonding semiconductor die to sub...
- Patent number 9,721,921
- Issue date Aug 1, 2017
- STATS ChipPAC Pte. Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive and insulating layers
- Patent number 9,406,533
- Issue date Aug 2, 2016
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of bonding semiconductor die to sub...
- Patent number 9,287,204
- Issue date Mar 15, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing flip chip semiconductor packages using dou...
- Patent number 9,252,130
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of simultaneous molding and thermal...
- Patent number 9,245,770
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20230411304
- Publication date Dec 21, 2023
- STATS ChipPAC Pte Ltd.
- Heeyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD FOR PROVIDING PERSONAL INFORMATION USING...
- Publication number 20210390209
- Publication date Dec 16, 2021
- Samsung Electronics Co., Ltd.
- Jaeyoung LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NONVOLATILE MEMORY DEVICE AND MEMORY SYSTEM INCLUDING NONVOLATILE M...
- Publication number 20200303015
- Publication date Sep 24, 2020
- Samsung Electronics Co., Ltd.
- SUNYEONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY DEVICE AND MEMORY SYSTEM INCLUDING NONVOLATILE M...
- Publication number 20190279719
- Publication date Sep 12, 2019
- Samsung Electronics Co., Ltd.
- SUNYEONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Partition Fence and Shie...
- Publication number 20180261551
- Publication date Sep 13, 2018
- STATS ChipPAC Pte Ltd.
- Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR AUTHENTICATING IDENTIFICATION INFO...
- Publication number 20170201378
- Publication date Jul 13, 2017
- SAMSUNG ELECTRONICS CO., LTD.
- Kyungmoon KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Methods of Forming Conductive and Insulating Layers
- Publication number 20160329310
- Publication date Nov 10, 2016
- STATS ChipPAC Pte Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Bonding Semiconductor Die to Sub...
- Publication number 20160163675
- Publication date Jun 9, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Conductive Materials on Contact Pads
- Publication number 20150004750
- Publication date Jan 1, 2015
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Conductive and Insulating Layers
- Publication number 20150004756
- Publication date Jan 1, 2015
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Manufacturing Flip Chip Semiconductor Packages Using Dou...
- Publication number 20140295618
- Publication date Oct 2, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Simultaneous Molding and Thermal...
- Publication number 20140175639
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Bonding Semiconductor Die to Sub...
- Publication number 20140175640
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

KyungMoon Kim

Person

Patents Grantslast 30 patents

Electronic device, method for providing personal information using...

Nonvolatile memory device and memory system including nonvolatile m...

Nonvolatile memory device and memory system including nonvolatile m...

Semiconductor device and method of forming partition fence and shie...

Methods of forming conductive and insulating layers

Semiconductor device and method of bonding semiconductor die to sub...

Methods of forming conductive and insulating layers

Semiconductor device and method of bonding semiconductor die to sub...

Methods of manufacturing flip chip semiconductor packages using dou...

Semiconductor device and method of simultaneous molding and thermal...

Semiconductor device and method of making bumpless flipchip interco...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

ELECTRONIC DEVICE, METHOD FOR PROVIDING PERSONAL INFORMATION USING...

NONVOLATILE MEMORY DEVICE AND MEMORY SYSTEM INCLUDING NONVOLATILE M...

NONVOLATILE MEMORY DEVICE AND MEMORY SYSTEM INCLUDING NONVOLATILE M...

Semiconductor Device and Method of Forming Partition Fence and Shie...

ELECTRONIC DEVICE AND METHOD FOR AUTHENTICATING IDENTIFICATION INFO...

Methods of Forming Conductive and Insulating Layers

Semiconductor Device and Method of Bonding Semiconductor Die to Sub...

Methods of Forming Conductive Materials on Contact Pads

Methods of Forming Conductive and Insulating Layers

Methods of Manufacturing Flip Chip Semiconductor Packages Using Dou...

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

Semiconductor Device and Method of Simultaneous Molding and Thermal...

Semiconductor Device and Method of Bonding Semiconductor Die to Sub...