L. David Bollinger

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Ridgefield, CT, US

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Patents Grantslast 30 patents

Information Patent Grant
System for improving the total thickness variation of a wafer
- Patent number 6,379,490
- Issue date Apr 30, 2002
- SpeedFam-IPEC Corporation
- L. David Bollinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for confinement of a plasma etch region for p...
- Patent number 5,336,355
- Issue date Aug 9, 1994
- Hughes Aircraft Company
- Charles B. Zarowin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for generating a plasma for "downstream" rapi...
- Patent number 5,290,382
- Issue date Mar 1, 1994
- Hughes Aircraft Company
- Charles B. Zarowin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to determine tool paths for thinning and correcting errors i...
- Patent number 5,291,415
- Issue date Mar 1, 1994
- Hughes Aircraft Company
- Charles B. Zarowin
- G05 - CONTROLLING REGULATING
Information Patent Grant
System for removing material from semiconductor wafers using a cont...
- Patent number 5,254,830
- Issue date Oct 19, 1993
- Hughes Aircraft Company
- Charles Zarowin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for removal of subsurface damage in semiconduc...
- Patent number 5,238,532
- Issue date Aug 24, 1993
- Hughes Aircraft Company
- Charles B. Zarowin
- H01 - BASIC ELECTRIC ELEMENTS