L. M. Mahalingam

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Scottsdale, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices with a thermally conductive layer and methods...
- Patent number 10,074,588
- Issue date Sep 11, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with a thermally conductive layer
- Patent number 9,614,046
- Issue date Apr 4, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with mechanical lock features between a semico...
- Patent number 9,425,161
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices with a thermally conductive layer and methods...
- Patent number 9,362,198
- Issue date Jun 7, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of their fabrication
- Patent number 9,099,567
- Issue date Aug 4, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Miniature moldlocks for heatsink or flag for an overmolded plastic...
- Patent number 7,091,602
- Issue date Aug 15, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Alexander J. Elliott
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Devices with a Thermally Conductive Layer and Methods...
- Publication number 20170207142
- Publication date Jul 20, 2017
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH A THERMALLY CONDUCTIVE LAYER
- Publication number 20160308010
- Publication date Oct 20, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH A THERMALLY CONDUCTIVE LAYER AND METHODS...
- Publication number 20150294921
- Publication date Oct 15, 2015
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK MOLDLOCKS
- Publication number 20060220187
- Publication date Oct 5, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Alexander J. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High impedance radio frequency power plastic package
- Publication number 20040241913
- Publication date Dec 2, 2004
- MOTOROLA, INC.
- Robert J. Mclaughlin
- H01 - BASIC ELECTRIC ELEMENTS