Lai Cheng Law

Follow

Person

Cheras, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Device package with rigid interconnect structure connecting die and...
- Patent number 8,927,345
- Issue date Jan 6, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods relating to intermetallic testing of bond integrity between...
- Patent number 8,741,666
- Issue date Jun 3, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Weng F Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brace for bond wire
- Patent number 8,680,660
- Issue date Mar 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lai Cheng Law
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
- Publication number 20140374467
- Publication date Dec 25, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE WITH RIGID INTERCONNECT STRUCTURE CONNECTING DIE AND...
- Publication number 20140008811
- Publication date Jan 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR INSPECTING FREE AIR BALL
- Publication number 20130341378
- Publication date Dec 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Seok Khoon Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CORE WIRE
- Publication number 20130319726
- Publication date Dec 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Chin Teck Siong
- H01 - BASIC ELECTRIC ELEMENTS