Lai Ming Lim

Follow

Person

Bukit Mertajam, MY

People

Patents Applicationslast 30 patents

Information Patent Application
BOND PAD CONNECTOR FOR SECURING AN ELECTRONIC COMPONENT THEREON
- Publication number 20240098895
- Publication date Mar 21, 2024
- Jabil Inc.
- Lun Hao Tung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE COMPOSITE SUBSTRATE FOR WEARABLE ANTENNA
- Publication number 20240088544
- Publication date Mar 14, 2024
- Jabil Inc.
- Yen San Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORK PATCH FOR AN ELECTRONIC CIRCUIT
- Publication number 20240040706
- Publication date Feb 1, 2024
- Jabil Inc.
- Muhammad Irsyad Bin Suhaimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR