Lai Yee Chia

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming conductive vias by direc...
- Patent number 10,553,487
- Issue date Feb 4, 2020
- STATS ChipPAC Pte. Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive pillar having...
- Patent number 9,824,923
- Issue date Nov 21, 2017
- STATS ChipPAC Pte. Ltd.
- Dzafir Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive vias by direc...
- Patent number 9,768,066
- Issue date Sep 19, 2017
- STATS ChipPAC Pte. Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming guard ring around conduc...
- Patent number 9,257,382
- Issue date Feb 9, 2016
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming adhesive layer over insu...
- Patent number 9,184,104
- Issue date Nov 10, 2015
- STATS ChipPAC, Ltd.
- Lai Yee Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming guard ring around conduc...
- Patent number 8,558,389
- Issue date Oct 15, 2013
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias by Direc...
- Publication number 20170365517
- Publication date Dec 21, 2017
- STATS ChipPAC Pte Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias by Direc...
- Publication number 20150380310
- Publication date Dec 31, 2015
- STATS ChipPAC, Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING ADHESIVE LAYER OVER INSU...
- Publication number 20150348861
- Publication date Dec 3, 2015
- STATS ChipPAC, Ltd.
- Lai Yee Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Guard Ring Around Conduc...
- Publication number 20130299998
- Publication date Nov 14, 2013
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Guard Ring Around Conduc...
- Publication number 20130147055
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Pillar Having...
- Publication number 20130093100
- Publication date Apr 18, 2013
- STATS ChipPAC, Ltd.
- Dzafir Shariff
- H01 - BASIC ELECTRIC ELEMENTS