Lakshmi Supriya

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Arlington, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods of processing a thermal interface material
- Patent number 8,383,459
- Issue date Feb 26, 2013
- Intel Corporation
- Lakshmi Supriya
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of forming an interconnect joint
- Patent number 8,124,517
- Issue date Feb 28, 2012
- Intel Corporation
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple die structure and method of forming a connection between f...
- Patent number 8,017,498
- Issue date Sep 13, 2011
- Intel Corporation
- Lakshmi Supriya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTIPLE DIE STRUCTURE AND METHOD OF FORMING A CONNECTION BETWEEN F...
- Publication number 20110240349
- Publication date Oct 6, 2011
- Lakshmi Supriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONNECT JOINT
- Publication number 20100276474
- Publication date Nov 4, 2010
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multiple die structure and method of forming a connection between f...
- Publication number 20100072617
- Publication date Mar 25, 2010
- Lakshmi Supriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROCESSING A THERMAL INTERFACE MATERIAL
- Publication number 20090317641
- Publication date Dec 24, 2009
- Lakshmi Supriya
- F28 - HEAT EXCHANGE IN GENERAL