Lakshmi Supriya

Person

Arlington, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Controlled fluid delivery in a microelectronic package
- Patent number 9,604,210
- Issue date Mar 28, 2017
- Intel Corporation
- Lakshmi Supriya
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Controlled fluid delivery in a microelectronic package
- Patent number 9,101,931
- Issue date Aug 11, 2015
- Intel Corporation
- Lakshmi Supriya
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Thermally conductive device with a thermal interface material
- Patent number 8,592,972
- Issue date Nov 26, 2013
- Intel Corporation
- Lakshmi Supriya
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus and methods of forming an interconnect between a workpiec...
- Patent number 8,183,697
- Issue date May 22, 2012
- Intel Corporation
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods to fabricate functionally gradient materials and structures...
- Patent number 8,173,259
- Issue date May 8, 2012
- Intel Corporation
- Lakshmi Supriya
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Apparatus and methods of forming an interconnect between a workpiec...
- Patent number 7,843,075
- Issue date Nov 30, 2010
- Intel Corporation
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming vias using sacrificial material
- Patent number 7,727,886
- Issue date Jun 1, 2010
- Intel Corporation
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microball attachment using self-assembly for substrate bumping
- Patent number 7,651,021
- Issue date Jan 26, 2010
- Intel Corporation
- Lakshmi Supriya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of holes in substrates using dewetting coatings
- Patent number 7,611,985
- Issue date Nov 3, 2009
- Intel Corporation
- James C. Matayabas, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONTROLLED FLUID DELIVERY IN A MICROELECTRONIC PACKAGE
- Publication number 20150209780
- Publication date Jul 30, 2015
- Intel Corporation
- Lakshmi Supriya
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHODS OF PROCESSING A THERMAL INTERFACE MATERIAL
- Publication number 20130140014
- Publication date Jun 6, 2013
- Lakshmi Supriya
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Apparatus And Methods Of Forming An Interconnect Between A Workpiec...
- Publication number 20110074023
- Publication date Mar 31, 2011
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and methods of forming an interconnect between a workpiec...
- Publication number 20090273914
- Publication date Nov 5, 2009
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROBALL ATTACHMENT USING SELF-ASSEMBLY FOR SUBSTRATE BUMPING
- Publication number 20090166396
- Publication date Jul 2, 2009
- Lakshmi SUPRIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLED FLUID DELIVERY IN A MICROELECTRONIC PACKAGE
- Publication number 20090169427
- Publication date Jul 2, 2009
- Lakshmi Supriya
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHODS TO FABRICATE FUNCTIONALLY GRADIENT MATERIALS AND STRUCTURES...
- Publication number 20090087644
- Publication date Apr 2, 2009
- Lakshmi Supriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming vias using sacrificial material
- Publication number 20090004841
- Publication date Jan 1, 2009
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING AN INTERCONNECT JOINT
- Publication number 20080311738
- Publication date Dec 18, 2008
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR ELECTROLESS PLATING OF METAL TRACES ON A SUBSTRATE AND...
- Publication number 20080160177
- Publication date Jul 3, 2008
- J. C. Mataybas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMATION OF HOLES IN SUBSTRATES USING DEWETTING COATINGS
- Publication number 20080070349
- Publication date Mar 20, 2008
- James C. Matayabas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Lakshmi Supriya

Person

Patents Grantslast 30 patents

Controlled fluid delivery in a microelectronic package

Controlled fluid delivery in a microelectronic package

Thermally conductive device with a thermal interface material

Apparatus and methods of forming an interconnect between a workpiec...

Methods to fabricate functionally gradient materials and structures...

Apparatus and methods of forming an interconnect between a workpiec...

Forming vias using sacrificial material

Microball attachment using self-assembly for substrate bumping

Formation of holes in substrates using dewetting coatings

Patents Applicationslast 30 patents

CONTROLLED FLUID DELIVERY IN A MICROELECTRONIC PACKAGE

METHODS OF PROCESSING A THERMAL INTERFACE MATERIAL

Apparatus And Methods Of Forming An Interconnect Between A Workpiec...

Apparatus and methods of forming an interconnect between a workpiec...

MICROBALL ATTACHMENT USING SELF-ASSEMBLY FOR SUBSTRATE BUMPING

CONTROLLED FLUID DELIVERY IN A MICROELECTRONIC PACKAGE

METHODS TO FABRICATE FUNCTIONALLY GRADIENT MATERIALS AND STRUCTURES...

Forming vias using sacrificial material

METHOD OF FORMING AN INTERCONNECT JOINT

METHODS FOR ELECTROLESS PLATING OF METAL TRACES ON A SUBSTRATE AND...

FORMATION OF HOLES IN SUBSTRATES USING DEWETTING COATINGS