Lakshmikanth Namburi

Person

Duarte, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Probe head for a microelectronic contactor assembly, and methods of...
- Patent number 8,901,950
- Issue date Dec 2, 2014
- Advantest America, Inc.
- Yohannes Desta
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic contactor assembly, structures thereof, and methods...
- Patent number 8,305,101
- Issue date Nov 6, 2012
- Advantest America, Inc.
- Yohannes Desta
- G01 - MEASURING TESTING
Information Patent Grant
Probe head for a microelectronic contactor assembly, the probe head...
- Patent number 8,232,818
- Issue date Jul 31, 2012
- Advantest America, Inc.
- Yohannes Desta
- G01 - MEASURING TESTING
Information Patent Grant
Method for repairing a microelectromechanical system
- Patent number 7,761,966
- Issue date Jul 27, 2010
- Touchdown Technologies, Inc.
- Lakshmikanth Namburi
- G01 - MEASURING TESTING
Information Patent Grant
Probe card substrate with bonded via
- Patent number 7,692,436
- Issue date Apr 6, 2010
- Touchdown Technologies, Inc.
- Raffi Garabedian
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PROBE CARD SUBSTRATE WITH BONDED VIA
- Publication number 20100308854
- Publication date Dec 9, 2010
- TOUCHDOWN TECHNOLOGIES, INC.
- Raffi Garabedian
- G01 - MEASURING TESTING
Information Patent Application
PROBE HEAD FOR A MICROELECTRONIC CONTACTOR ASSEMBLY, THE PROBE HEAD...
- Publication number 20100237889
- Publication date Sep 23, 2010
- TOUCHDOWN TECHNOLOGIES, INC.
- Yohannes Desta
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTRONIC CONTACTOR ASSEMBLY, STRUCTURES THEREOF, AND METHODS...
- Publication number 20100237887
- Publication date Sep 23, 2010
- TOUCHDOWN TECHNOLOGIES, INC.
- Yohannes Desta
- G01 - MEASURING TESTING
Information Patent Application
PROBE HEAD FOR A MICROELECTRONIC CONTACTOR ASSEMBLY, AND METHODS OF...
- Publication number 20100237888
- Publication date Sep 23, 2010
- TOUCHDOWN TECHNOLOGIES, INC.
- Yohannes Desta
- G01 - MEASURING TESTING
Information Patent Application
Probe card substrate with bonded via
- Publication number 20090237099
- Publication date Sep 24, 2009
- TOUCHDOWN TECHNOLOGIES, INC.
- Raffi Garabedian
- G01 - MEASURING TESTING
Information Patent Application
Multi-Pivot Probe Card For Testing Semiconductor Devices
- Publication number 20090072851
- Publication date Mar 19, 2009
- TOUCHDOWN TECHNOLOGIES, INC.
- Lakshmikanth Namburi
- G01 - MEASURING TESTING
Information Patent Application
DEVICE AND METHOD FOR REPARING A MICROELECTROMECHANICAL SYSTEM
- Publication number 20090021277
- Publication date Jan 22, 2009
- TOUCHDOWN TECHNOLOGIES, INC.
- Lakshmikanth Namburi
- G01 - MEASURING TESTING
Information Patent Application
Process for forming microstructures
- Publication number 20060134820
- Publication date Jun 22, 2006
- TOUCHDOWN TECHNOLOGIES, INC.
- Weilong Tang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Lakshmikanth Namburi

Person

Patents Grantslast 30 patents

Probe head for a microelectronic contactor assembly, and methods of...

Microelectronic contactor assembly, structures thereof, and methods...

Probe head for a microelectronic contactor assembly, the probe head...

Method for repairing a microelectromechanical system

Probe card substrate with bonded via

Patents Applicationslast 30 patents

PROBE CARD SUBSTRATE WITH BONDED VIA

PROBE HEAD FOR A MICROELECTRONIC CONTACTOR ASSEMBLY, THE PROBE HEAD...

MICROELECTRONIC CONTACTOR ASSEMBLY, STRUCTURES THEREOF, AND METHODS...

PROBE HEAD FOR A MICROELECTRONIC CONTACTOR ASSEMBLY, AND METHODS OF...

Probe card substrate with bonded via

Multi-Pivot Probe Card For Testing Semiconductor Devices

DEVICE AND METHOD FOR REPARING A MICROELECTROMECHANICAL SYSTEM

Process for forming microstructures