LALGUDI M. MAHALINGAM

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SCOTTSDALE, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for bonding a die and a substrate
- Patent number 9,111,901
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices that include a die bonded to a substrate with...
- Patent number 9,105,599
- Issue date Aug 11, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding a semiconductor device
- Patent number 8,753,983
- Issue date Jun 17, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR BONDING A DIE AND A SUBSTRATE
- Publication number 20140256091
- Publication date Sep 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- JIN-WOOK JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES THAT INCLUDE A DIE BONDED TO A SUBSTRATE WITH...
- Publication number 20140252586
- Publication date Sep 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- JIN-WOOK JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING A SEMICONDUCTOR DEVICE
- Publication number 20110163439
- Publication date Jul 7, 2011
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS