Lan Chu Tan

Person

Shah Alarm, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Pressure sensor and method of packaging same
- Patent number 8,716,846
- Issue date May 6, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor and method of assembling same
- Patent number 8,378,435
- Issue date Feb 19, 2013
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Grant
Solder ball attachment ring and method of use
- Patent number 7,985,672
- Issue date Jul 26, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer with improved crack protection
- Patent number 7,741,196
- Issue date Jun 22, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming reinforced interconnects on a substrate
- Patent number 7,494,924
- Issue date Feb 24, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming stackable package
- Patent number 7,384,819
- Issue date Jun 10, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebonding insulated wire and capillary therefor
- Patent number 7,261,230
- Issue date Aug 28, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Fuaida Harun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making reinforced semiconductor package
- Patent number 7,160,798
- Issue date Jan 9, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Viswanadam Gautham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad for a packaged integrated circuit
- Patent number 7,042,098
- Issue date May 9, 2006
- Freescale Semiconductor,INC
- Fuaida Harun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die having a copper contact and method therefor
- Patent number 6,933,614
- Issue date Aug 23, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 6,900,531
- Issue date May 31, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing copper metallization die for wirebonding
- Patent number 6,693,020
- Issue date Feb 17, 2004
- Motorola, Inc.
- Kok Wai Mui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad
- Patent number 6,563,226
- Issue date May 13, 2003
- Motorola, Inc.
- Fuaida Bte Harun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20120306031
- Publication date Dec 6, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
- Publication number 20120168884
- Publication date Jul 5, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
- Publication number 20120139067
- Publication date Jun 7, 2012
- FREESCALE SEMICONDUCTOR, INC.
- WAI YEW LO
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR AND METHOD OF ASSEMBLING SAME
- Publication number 20120139063
- Publication date Jun 7, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Application
POLYMER CORE WIRE
- Publication number 20120073859
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE
- Publication number 20110084411
- Publication date Apr 14, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING TAPE BALL GRID ARRAY PACKAGE
- Publication number 20110059579
- Publication date Mar 10, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL ATTACHMENT RING AND METHOD OF USE
- Publication number 20090134207
- Publication date May 28, 2009
- Poh Leng EU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND PAD FOR SEMICONDUCTOR DEVICE
- Publication number 20080182120
- Publication date Jul 31, 2008
- Lan Chu Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH IMPROVED CRACK PROTECTION
- Publication number 20080179710
- Publication date Jul 31, 2008
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A TRACE EMBEDDED PACKAGE
- Publication number 20070281393
- Publication date Dec 6, 2007
- Viswanadam Gautham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming stackable package
- Publication number 20070254409
- Publication date Nov 1, 2007
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming reinforced interconnects on a substrate
- Publication number 20070207605
- Publication date Sep 6, 2007
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding pad for a packaged integrated circuit
- Publication number 20060231959
- Publication date Oct 19, 2006
- Fuaida Harun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making reinforced semiconductor package
- Publication number 20060189120
- Publication date Aug 24, 2006
- Viswanadam Gautham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wirebonding insulated wire and capillary therefor
- Publication number 20050045692
- Publication date Mar 3, 2005
- Fuaida Harun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding pad for a packaged integrated circuit
- Publication number 20050006734
- Publication date Jan 13, 2005
- Fuaida Harun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die having a copper contact and method therefor
- Publication number 20040195696
- Publication date Oct 7, 2004
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor device
- Publication number 20040080037
- Publication date Apr 29, 2004
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip optical and imaging sensor device
- Publication number 20040065933
- Publication date Apr 8, 2004
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die semiconductor device
- Publication number 20030230796
- Publication date Dec 18, 2003
- Aminuddin Ismail
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die semiconductor device
- Publication number 20030111720
- Publication date Jun 19, 2003
- Lan Chu Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pad
- Publication number 20020175411
- Publication date Nov 28, 2002
- MOTOROLA, INC.
- Fuaida Bte Harun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of preparing copper metallization die for wirebonding
- Publication number 20020127825
- Publication date Sep 12, 2002
- MOTOROLA, INC.
- Kok Wai Mui
- H01 - BASIC ELECTRIC ELEMENTS

Lan Chu Tan

Person

Patents Grantslast 30 patents

Pressure sensor and method of packaging same

Pressure sensor and method of assembling same

Solder ball attachment ring and method of use

Semiconductor wafer with improved crack protection

Method for forming reinforced interconnects on a substrate

Method of forming stackable package

Wirebonding insulated wire and capillary therefor

Method of making reinforced semiconductor package

Bonding pad for a packaged integrated circuit

Integrated circuit die having a copper contact and method therefor

Image sensor device

Method of preparing copper metallization die for wirebonding

Bonding pad

Patents Applicationslast 30 patents

SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

PRESSURE SENSOR AND METHOD OF ASSEMBLING SAME

POLYMER CORE WIRE

SEMICONDUCTOR DIE

METHOD OF FORMING TAPE BALL GRID ARRAY PACKAGE

SOLDER BALL ATTACHMENT RING AND METHOD OF USE

BOND PAD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER WITH IMPROVED CRACK PROTECTION

METHOD OF FORMING A TRACE EMBEDDED PACKAGE

Method of forming stackable package

Method for forming reinforced interconnects on a substrate

Bonding pad for a packaged integrated circuit

Method of making reinforced semiconductor package

Wirebonding insulated wire and capillary therefor

Bonding pad for a packaged integrated circuit

Integrated circuit die having a copper contact and method therefor

Image sensor device

Flip chip optical and imaging sensor device

Stacked die semiconductor device

Stacked die semiconductor device

Bonding pad

Method of preparing copper metallization die for wirebonding