Lan H. Hoang

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sidewall connections and button interconnects for molded SiPs
- Patent number 12,148,741
- Issue date Nov 19, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Built-in connector for board-to-board and flex-to-rigid board conne...
- Patent number 12,095,185
- Issue date Sep 17, 2024
- Apple Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flex board and flexible module
- Patent number 12,040,262
- Issue date Jul 16, 2024
- Apple Inc.
- Dennis R. Pyper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective soldering with photonic soldering technology
- Patent number 12,041,728
- Issue date Jul 16, 2024
- Apple Inc.
- Maryam Rahimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Right angle sidewall and button interconnects for molded SiPs
- Patent number 11,765,838
- Issue date Sep 19, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System in package for lower z height and reworkable component assembly
- Patent number 11,462,461
- Issue date Oct 4, 2022
- Apple Inc.
- Leilei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical components attached to fabric
- Patent number 11,388,817
- Issue date Jul 12, 2022
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
System-in-package including opposing circuit boards
- Patent number 10,966,321
- Issue date Mar 30, 2021
- Apple Inc.
- Yanfeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical components attached to fabric
- Patent number 10,959,331
- Issue date Mar 23, 2021
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
System-in-package including opposing circuit boards
- Patent number 10,709,018
- Issue date Jul 7, 2020
- Apple Inc.
- Yanfeng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical components attached to fabric
- Patent number 10,701,802
- Issue date Jun 30, 2020
- Apple Inc.
- Daniel D. Sunshine
- A41 - WEARING APPAREL
Information Patent Grant
Interconnect frames for SIP modules
- Patent number 10,638,608
- Issue date Apr 28, 2020
- Apple Inc.
- Lan H. Hoang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-profile space-efficient shielding for SIP module
- Patent number 10,624,214
- Issue date Apr 14, 2020
- Apple Inc.
- Amir Salehi
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Vertical module and perpendicular pin array interconnect for stacke...
- Patent number 10,602,612
- Issue date Mar 24, 2020
- Apple Inc.
- Lan H. Hoang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical components attached to fabric
- Patent number 10,485,103
- Issue date Nov 19, 2019
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
System-in-package including opposing circuit boards
- Patent number 10,356,903
- Issue date Jul 16, 2019
- Apple Inc.
- Yanfeng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Area-efficient connections to SIP modules
- Patent number 10,334,732
- Issue date Jun 25, 2019
- Apple Inc.
- Lan H. Hoang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical shielding and interconnect for SIP modules
- Patent number 10,292,258
- Issue date May 14, 2019
- Apple Inc.
- Lan H. Hoang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device and method of bonding semiconductor die to sub...
- Patent number 9,721,921
- Issue date Aug 1, 2017
- STATS ChipPAC Pte. Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of bonding semiconductor die to sub...
- Patent number 9,287,204
- Issue date Mar 15, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of simultaneous molding and thermal...
- Patent number 9,245,770
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded integrated circuit package and method of forming a molded in...
- Patent number 7,906,857
- Issue date Mar 15, 2011
- Xilinx, Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite flip-chip package with encased components and method of f...
- Patent number 7,696,006
- Issue date Apr 13, 2010
- Xilinx, Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite flip-chip package with encased components and method of f...
- Patent number 7,378,733
- Issue date May 27, 2008
- Xilinx, Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded high density electronic packaging structure for high perform...
- Patent number 7,361,995
- Issue date Apr 22, 2008
- Xilinx, Inc.
- Kim Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip configuration to connect flip-chips to flip-chips
- Patent number 7,098,542
- Issue date Aug 29, 2006
- Xilinx, Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance flipchip package that incorporates heat removal wi...
- Patent number 7,061,102
- Issue date Jun 13, 2006
- Xilinx, Inc.
- Abu K. Eghan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip integrated circuit packages accommodating exposed chip ca...
- Patent number 6,744,131
- Issue date Jun 1, 2004
- Xilinx, Inc.
- Lan Hoang Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using both a non-filled flux underfill and a filled flux...
- Patent number 6,475,828
- Issue date Nov 5, 2002
- LSI Logic Corporation
- Lan Hoang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR TEMPERATURE SENSING USING THERMOPILE INTEGRAT...
- Publication number 20230099638
- Publication date Mar 30, 2023
- Apple Inc.
- James C. CLEMENTS
- G01 - MEASURING TESTING
Information Patent Application
Built-In Connector for Board-to-Board and Flex-to-Rigid Board Conne...
- Publication number 20230089258
- Publication date Mar 23, 2023
- Apple Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURES ON SYSTEM-IN-PACKAGE SURFACES
- Publication number 20230078536
- Publication date Mar 16, 2023
- Apple Inc.
- Ali N. Ergun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall Connections and Button Interconnects for Molded SiPs
- Publication number 20230056922
- Publication date Feb 23, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Right Angle Sidewall and Button Interconnects for Molded SiPs
- Publication number 20230055647
- Publication date Feb 23, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flex Board and Flexible Module
- Publication number 20230026254
- Publication date Jan 26, 2023
- Apple Inc.
- Dennis R. Pyper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System In Package for Lower Z Height and Reworkable Component Assembly
- Publication number 20210384113
- Publication date Dec 9, 2021
- Apple Inc.
- Leilei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Components Attached to Fabric
- Publication number 20210185808
- Publication date Jun 17, 2021
- Apple Inc.
- Daniel D. Sunshine
- A41 - WEARING APPAREL
Information Patent Application
Selective Soldering with Photonic Soldering Technology
- Publication number 20210185831
- Publication date Jun 17, 2021
- Apple Inc.
- Maryam Rahimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Selective Soldering with Photonic Soldering Technology
- Publication number 20210043597
- Publication date Feb 11, 2021
- Apple Inc.
- Leilei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS
- Publication number 20200375033
- Publication date Nov 26, 2020
- Apple Inc.
- Yanfeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Components Attached to Fabric
- Publication number 20200329559
- Publication date Oct 15, 2020
- Apple Inc.
- Daniel D. Sunshine
- A41 - WEARING APPAREL
Information Patent Application
Electrical Components Attached to Fabric
- Publication number 20200084886
- Publication date Mar 12, 2020
- Apple Inc.
- Daniel D. Sunshine
- A41 - WEARING APPAREL
Information Patent Application
SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS
- Publication number 20190306979
- Publication date Oct 3, 2019
- Apple Inc.
- Yanfeng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AREA-EFFICIENT CONNECTIONS TO SIP MODULES
- Publication number 20190098762
- Publication date Mar 28, 2019
- Apple Inc.
- Lan H. Hoang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT FRAMES FOR SIP MODULES
- Publication number 20190082538
- Publication date Mar 14, 2019
- Apple Inc.
- Lan H. Hoang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT FRAMES FOR SIP MODULES
- Publication number 20190082534
- Publication date Mar 14, 2019
- Apple Inc.
- Lan H. Hoang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES
- Publication number 20180049311
- Publication date Feb 15, 2018
- Apple Inc.
- Lan H. Hoang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES
- Publication number 20160286647
- Publication date Sep 29, 2016
- Apple Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE SPACE-EFFICIENT SHIELDING FOR SIP MODULE
- Publication number 20160270213
- Publication date Sep 15, 2016
- Apple Inc.
- Amir Salehi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Bonding Semiconductor Die to Sub...
- Publication number 20160163675
- Publication date Jun 9, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Simultaneous Molding and Thermal...
- Publication number 20140175639
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Bonding Semiconductor Die to Sub...
- Publication number 20140175640
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded high density electronic packaging structure for high perform...
- Publication number 20060087033
- Publication date Apr 27, 2006
- Kim Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance flipchip package that incorporates heat removal wi...
- Publication number 20020185717
- Publication date Dec 12, 2002
- Xilinx, Inc.
- Abu K. Eghan
- H01 - BASIC ELECTRIC ELEMENTS

Lan H. Hoang

Person

Patents Grantslast 30 patents

Sidewall connections and button interconnects for molded SiPs

Built-in connector for board-to-board and flex-to-rigid board conne...

Flex board and flexible module

Selective soldering with photonic soldering technology

Right angle sidewall and button interconnects for molded SiPs

System in package for lower z height and reworkable component assembly

Electrical components attached to fabric

System-in-package including opposing circuit boards

Electrical components attached to fabric

System-in-package including opposing circuit boards

Electrical components attached to fabric

Interconnect frames for SIP modules

Low-profile space-efficient shielding for SIP module

Vertical module and perpendicular pin array interconnect for stacke...

Electrical components attached to fabric

System-in-package including opposing circuit boards

Area-efficient connections to SIP modules

Vertical shielding and interconnect for SIP modules

Semiconductor device and method of bonding semiconductor die to sub...

Semiconductor device and method of bonding semiconductor die to sub...

Semiconductor device and method of simultaneous molding and thermal...

Semiconductor device and method of making bumpless flipchip interco...

Molded integrated circuit package and method of forming a molded in...

Composite flip-chip package with encased components and method of f...

Composite flip-chip package with encased components and method of f...

Molded high density electronic packaging structure for high perform...

Multi-chip configuration to connect flip-chips to flip-chips

High performance flipchip package that incorporates heat removal wi...

Flip chip integrated circuit packages accommodating exposed chip ca...

Method of using both a non-filled flux underfill and a filled flux...

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR TEMPERATURE SENSING USING THERMOPILE INTEGRAT...

Built-In Connector for Board-to-Board and Flex-to-Rigid Board Conne...

CONDUCTIVE FEATURES ON SYSTEM-IN-PACKAGE SURFACES

Sidewall Connections and Button Interconnects for Molded SiPs

Right Angle Sidewall and Button Interconnects for Molded SiPs

Flex Board and Flexible Module

System In Package for Lower Z Height and Reworkable Component Assembly

Electrical Components Attached to Fabric

Selective Soldering with Photonic Soldering Technology

Selective Soldering with Photonic Soldering Technology

SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS

Electrical Components Attached to Fabric

Electrical Components Attached to Fabric

SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS

AREA-EFFICIENT CONNECTIONS TO SIP MODULES

INTERCONNECT FRAMES FOR SIP MODULES

INTERCONNECT FRAMES FOR SIP MODULES

VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES

VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES

LOW-PROFILE SPACE-EFFICIENT SHIELDING FOR SIP MODULE

Semiconductor Device and Method of Bonding Semiconductor Die to Sub...

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

Semiconductor Device and Method of Simultaneous Molding and Thermal...

Semiconductor Device and Method of Bonding Semiconductor Die to Sub...

Molded high density electronic packaging structure for high perform...

High performance flipchip package that incorporates heat removal wi...