Lan-Lin Chao

Person

Sindian City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 11,854,795
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,735,635
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Han Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low contamination chamber for surface activation
- Patent number 11,508,562
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 11,282,697
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,069,785
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Han Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor package and semiconductor package
- Patent number 11,014,805
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D integrated circuit and methods of forming the same
- Patent number 10,790,189
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 10,665,449
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming micro electromechanical system sensor
- Patent number 10,384,933
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multiple metal layer semiconductor device and low temperature stack...
- Patent number 10,283,448
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 10,276,678
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Han Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a semiconductor structure
- Patent number 10,160,638
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Cheng Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer bonding process and structure
- Patent number 10,128,209
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biological sensing structures
- Patent number 10,119,909
- Issue date Nov 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- G01 - MEASURING TESTING
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for image sensor packaging
- Patent number 10,096,645
- Issue date Oct 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit and methods of forming the same
- Patent number 10,090,196
- Issue date Oct 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for wafer level bonding
- Patent number 10,049,901
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment systems and wafer bonding systems and methods
- Patent number 10,037,968
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding mechanisms for semiconductor wafers
- Patent number 9,960,129
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for cleaning
- Patent number 9,953,847
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple metal layer semiconductor device and low temperature stack...
- Patent number 9,887,155
- Issue date Feb 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for verification of bonding alignment
- Patent number 9,842,785
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air trench in packages incorporating hybrid bonding
- Patent number 9,786,628
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 9,754,827
- Issue date Sep 5, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Han Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,748,198
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debonding schemes
- Patent number 9,741,681
- Issue date Aug 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Multiple swivel arm design in hybrid bonder
- Patent number 9,735,033
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro electromechanical system sensor and method of forming the same
- Patent number 9,725,310
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM
- Publication number 20240087879
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220310449
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrate Rinse Module in Hybrid Bonding Platform
- Publication number 20220216052
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220208607
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20210343849
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- Chun-Han TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20210151353
- Publication date May 20, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20210013098
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
- Publication number 20200002161
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrate Rinse Module in Hybrid Bonding Platform
- Publication number 20200006052
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20190259848
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- Chun-Han TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20190035681
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Metal Layer Semiconductor Device and Low Temperature Stack...
- Publication number 20180226337
- Publication date Aug 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20170365514
- Publication date Dec 21, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- Chun-Han TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20170358551
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING MICRO ELECTROMECHANICAL SYSTEM SENSOR
- Publication number 20170313581
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ALIGNMENT SYSTEMS AND WAFER BONDING SYSTEMS AND METHODS
- Publication number 20170243853
- Publication date Aug 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR WAFER LEVEL BONDING
- Publication number 20170140955
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Debonding Schemes
- Publication number 20170077062
- Publication date Mar 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Trench in Packages Incorporating Hybrid Bonding
- Publication number 20170069593
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus And Method For Verification Of Bonding Alignment
- Publication number 20170047260
- Publication date Feb 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrate Rinse Module in Hybrid Bonding Platform
- Publication number 20170004964
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer Bonding Process and Structure
- Publication number 20160358882
- Publication date Dec 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Swivel Arm Design in Hybrid Bonder
- Publication number 20160351422
- Publication date Dec 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Image Sensor Packaging
- Publication number 20160307944
- Publication date Oct 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Biological Sensing Structures
- Publication number 20160299068
- Publication date Oct 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua LIN
- G01 - MEASURING TESTING
Information Patent Application
SELF-REMOVAL ANTI-STICTION COATING FOR BONDING PROCESS
- Publication number 20160229693
- Publication date Aug 11, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Low Contamination Chamber for Surface Activation
- Publication number 20160181073
- Publication date Jun 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Trench in Packages Incorporating Hybrid Bonding
- Publication number 20160163684
- Publication date Jun 9, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20160155665
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS

Lan-Lin Chao

Person

Patents Grantslast 30 patents

Integrate rinse module in hybrid bonding platform

Semiconductor device and fabrication method thereof

Low contamination chamber for surface activation

Integrate rinse module in hybrid bonding platform

Semiconductor device and fabrication method thereof

Method of forming semiconductor package and semiconductor package

3D integrated circuit and methods of forming the same

Integrate rinse module in hybrid bonding platform

Method of forming micro electromechanical system sensor

Hybrid bonding systems and methods for semiconductor wafers

Multiple metal layer semiconductor device and low temperature stack...

Semiconductor device and fabrication method thereof

Method and apparatus for a semiconductor structure

Wafer bonding process and structure

Biological sensing structures

Hybrid bonding systems and methods for semiconductor wafers

Method and apparatus for image sensor packaging

3D integrated circuit and methods of forming the same

Apparatus and method for wafer level bonding

Alignment systems and wafer bonding systems and methods

Hybrid bonding mechanisms for semiconductor wafers

Apparatus and method for cleaning

Multiple metal layer semiconductor device and low temperature stack...

Apparatus and method for verification of bonding alignment

Air trench in packages incorporating hybrid bonding

Semiconductor device and fabrication method thereof

Hybrid bonding systems and methods for semiconductor wafers

Debonding schemes

Multiple swivel arm design in hybrid bonder

Micro electromechanical system sensor and method of forming the same

Patents Applicationslast 30 patents

INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM

3D Integrated Circuit and Methods of Forming the Same

Integrate Rinse Module in Hybrid Bonding Platform

3D Integrated Circuit and Methods of Forming the Same

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

3D Integrated Circuit and Methods of Forming the Same

3D Integrated Circuit and Methods of Forming the Same

METHOD OF FORMING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

Integrate Rinse Module in Hybrid Bonding Platform

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Hybrid Bonding Systems and Methods for Semiconductor Wafers

3D Integrated Circuit and Methods of Forming the Same

Multiple Metal Layer Semiconductor Device and Low Temperature Stack...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Hybrid Bonding Systems and Methods for Semiconductor Wafers

METHOD OF FORMING MICRO ELECTROMECHANICAL SYSTEM SENSOR

ALIGNMENT SYSTEMS AND WAFER BONDING SYSTEMS AND METHODS

APPARATUS AND METHOD FOR WAFER LEVEL BONDING

Debonding Schemes

Air Trench in Packages Incorporating Hybrid Bonding

Apparatus And Method For Verification Of Bonding Alignment

Integrate Rinse Module in Hybrid Bonding Platform

Wafer Bonding Process and Structure

Multiple Swivel Arm Design in Hybrid Bonder

Method and Apparatus for Image Sensor Packaging

Biological Sensing Structures

SELF-REMOVAL ANTI-STICTION COATING FOR BONDING PROCESS

Low Contamination Chamber for Surface Activation

Air Trench in Packages Incorporating Hybrid Bonding

3D Integrated Circuit and Methods of Forming the Same