Lan Peng

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Leuven, BE

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Patents Grantslast 30 patents

Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,886,252
- Issue date Jan 5, 2021
- Imec VZW
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,141,284
- Issue date Nov 27, 2018
- Imec VZW
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Process for Wafer Bonding
- Publication number 20240112944
- Publication date Apr 4, 2024
- IMEC vzw
- Jakob Visker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SILICON ON NITRIDE SUBSTRATE
- Publication number 20210005444
- Publication date Jan 7, 2021
- IMEC vzw
- Hu LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20180247914
- Publication date Aug 30, 2018
- IMEC vzw
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20170301646
- Publication date Oct 19, 2017
- IMEC vzw
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS