Lance C. Wright

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive plate stress reduction feature
- Patent number 11,658,130
- Issue date May 23, 2023
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,177,197
- Issue date Nov 16, 2021
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete device mounted on substrate
- Patent number 9,899,339
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor having light-blocking structure in leadframe and m...
- Patent number 9,608,158
- Issue date Mar 28, 2017
- Texas Instruments Incorporated
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor having light-blocking structure in leadframe and m...
- Patent number 9,515,059
- Issue date Dec 6, 2016
- Texas Instruments Incorporated
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating a proximity sensor having light-blocking structure in l...
- Patent number 9,171,830
- Issue date Oct 27, 2015
- Texas Instruments Incorporated
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with printed circuit layer
- Patent number 9,111,845
- Issue date Aug 18, 2015
- Texas Instruments Incorporated
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Proximity sensor having light blocking structure in leadframe
- Patent number 8,994,154
- Issue date Mar 31, 2015
- Texas Instruments Incorporated
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with three dimensional inkjet printed traces
- Patent number 8,945,986
- Issue date Feb 3, 2015
- Texas Instruments Incorporated
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package with printed circuit layer
- Patent number 8,847,349
- Issue date Sep 30, 2014
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with three dimensional inkjet printed traces
- Patent number 8,816,513
- Issue date Aug 26, 2014
- Texas Instruments Incorporated
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exposed die package for direct surface mounting
- Patent number 8,470,644
- Issue date Jun 25, 2013
- Texas Instruments Incorporated
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die package for direct surface mounting
- Patent number 8,304,871
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method of packaging semiconductor devices
- Patent number 7,320,903
- Issue date Jan 22, 2008
- Texas Instruments Incorporated
- Lance Cole Wright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method for securing the device in a carr...
- Patent number 7,061,108
- Issue date Jun 13, 2006
- Texas Instruments Incorporated
- Lance C. Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method of packaging semiconductor devices
- Patent number 6,977,191
- Issue date Dec 20, 2005
- Texas Instruments Incorporated
- Lance Cole Wright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for and method of packaging semiconductor devices
- Patent number 6,774,485
- Issue date Aug 10, 2004
- Texas Instruments Incorporated
- Lance Cole Wright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Efficient illumination system for wire bonders
- Patent number 6,292,580
- Issue date Sep 18, 2001
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Efficient hybrid illuminator
- Patent number 6,042,247
- Issue date Mar 28, 2000
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE PLATE STRESS REDUCTION FEATURE
- Publication number 20220208692
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
- Publication number 20220115308
- Publication date Apr 14, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
- Publication number 20210090980
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Proximity Sensor Having Light-Blocking Structure in Leadframe and M...
- Publication number 20170047469
- Publication date Feb 16, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR HAVING LIGHT-BLOCKING STRUCTURE IN LEADFRAME AND M...
- Publication number 20160043064
- Publication date Feb 11, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabricating a Proximity Sensor Having Light-Blocking Structure in L...
- Publication number 20150162317
- Publication date Jun 11, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER
- Publication number 20140361402
- Publication date Dec 11, 2014
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER
- Publication number 20140175599
- Publication date Jun 26, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly with Three Dimensional Inkjet Printed Traces
- Publication number 20140127856
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DEVICE MOUNTED ON SUBSTRATE
- Publication number 20140124939
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Blocking Structure in Leadframe
- Publication number 20140091326
- Publication date Apr 3, 2014
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly With Three Dimensional Inkjet Printed Traces
- Publication number 20140054795
- Publication date Feb 27, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Exposed Die Package for Direct Surface Mounting
- Publication number 20130034937
- Publication date Feb 7, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED DIE PACKAGE FOR DIRECT SURFACE MOUNTING
- Publication number 20120256306
- Publication date Oct 11, 2012
- TEXAS INSTRUMENTS INCORPORATED
- FRANK YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Leadframe
- Publication number 20080290481
- Publication date Nov 27, 2008
- Takahiko Kudoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having directly attached heat spreader
- Publication number 20060170080
- Publication date Aug 3, 2006
- Edgar R. Zuniga-Ortiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for and method of packaging semiconductor devices
- Publication number 20060055026
- Publication date Mar 16, 2006
- Lance Cole Wright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for securing a semiconductor device in a carrier tape
- Publication number 20050073037
- Publication date Apr 7, 2005
- Lance C. Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus to minimize paper particulate from paper based carrier ta...
- Publication number 20040226857
- Publication date Nov 18, 2004
- Lance Cole Wright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flex resistant semiconductor die pad, leadframe, and package
- Publication number 20040227216
- Publication date Nov 18, 2004
- Robert F. Mortan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for and method of packaging semiconductor devices
- Publication number 20040165975
- Publication date Aug 26, 2004
- Lance Cole Wright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip carrier tape
- Publication number 20030218236
- Publication date Nov 27, 2003
- Lance Cole Wright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for and method of packaging semiconductor devices
- Publication number 20030124772
- Publication date Jul 3, 2003
- Lance Cole Wright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Lance C. Wright

Person

Patents Grantslast 30 patents

Semiconductor package with solder standoff

Conductive plate stress reduction feature

Semiconductor package with solder standoff

Discrete device mounted on substrate

Proximity sensor having light-blocking structure in leadframe and m...

Proximity sensor having light-blocking structure in leadframe and m...

Fabricating a proximity sensor having light-blocking structure in l...

Integrated circuit package with printed circuit layer

Proximity sensor having light blocking structure in leadframe

Electronic assembly with three dimensional inkjet printed traces

Integrated circuit package with printed circuit layer

Electronic assembly with three dimensional inkjet printed traces

Exposed die package for direct surface mounting

Exposed die package for direct surface mounting

Apparatus for and method of packaging semiconductor devices

Semiconductor device and a method for securing the device in a carr...

Apparatus for and method of packaging semiconductor devices

Apparatus for and method of packaging semiconductor devices

Efficient illumination system for wire bonders

Efficient hybrid illuminator

Patents Applicationslast 30 patents

CONDUCTIVE PLATE STRESS REDUCTION FEATURE

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

Proximity Sensor Having Light-Blocking Structure in Leadframe and M...

PROXIMITY SENSOR HAVING LIGHT-BLOCKING STRUCTURE IN LEADFRAME AND M...

Fabricating a Proximity Sensor Having Light-Blocking Structure in L...

INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER

INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER

Electronic Assembly with Three Dimensional Inkjet Printed Traces

DISCRETE DEVICE MOUNTED ON SUBSTRATE

Light Blocking Structure in Leadframe

Electronic Assembly With Three Dimensional Inkjet Printed Traces

Exposed Die Package for Direct Surface Mounting

EXPOSED DIE PACKAGE FOR DIRECT SURFACE MOUNTING

Semiconductor Device Package Leadframe

Semiconductor device having directly attached heat spreader

Apparatus for and method of packaging semiconductor devices

Method for securing a semiconductor device in a carrier tape

Apparatus to minimize paper particulate from paper based carrier ta...

Flex resistant semiconductor die pad, leadframe, and package

Apparatus for and method of packaging semiconductor devices

Chip carrier tape

Apparatus for and method of packaging semiconductor devices