LANCE KAUFMAN

Person

PARADISE VALLEY, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a circuit assembly
- Patent number 5,070,602
- Issue date Dec 10, 1991
- Lance R. Kaufman
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric circuit assembly with voltage isolation
- Patent number 5,032,691
- Issue date Jul 16, 1991
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit assembly and method with direct bonded terminal pin
- Patent number 4,990,720
- Issue date Feb 5, 1991
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sense circuit
- Patent number 4,945,445
- Issue date Jul 31, 1990
- Gentron Corporation
- Richard F. Schmerda
- G01 - MEASURING TESTING
Information Patent Grant
Direct bond circuit assembly with crimped lead frame
- Patent number 4,924,292
- Issue date May 8, 1990
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bolted circuit assembly with isolating washer
- Patent number 4,907,124
- Issue date Mar 6, 1990
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic direct bond circuit assembly
- Patent number 4,902,854
- Issue date Feb 20, 1990
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bond circuit assembly with ground plane
- Patent number 4,879,633
- Issue date Nov 7, 1989
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink apparatus with electrically insulative intermediate condu...
- Patent number 4,860,164
- Issue date Aug 22, 1989
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bond circuit assembly with crimped lead frame
- Patent number 4,831,723
- Issue date May 23, 1989
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct current sense lead
- Patent number 4,818,895
- Issue date Apr 4, 1989
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated package for multiple semiconductor power components
- Patent number 4,819,042
- Issue date Apr 4, 1989
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making circuit assembly with hardened direct bond lead frame
- Patent number 4,788,765
- Issue date Dec 6, 1988
- Gentron Corporation
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package with thermal expansion relief chimney
- Patent number 4,739,449
- Issue date Apr 19, 1988
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost compressively clamped circuit and heat sink assembly
- Patent number 4,724,514
- Issue date Feb 9, 1988
- Lance R. Kaufman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Isolation transformer
- Patent number 4,713,723
- Issue date Dec 15, 1987
- Lance R. Kaufman
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit assembly with semiconductor expansion matched thermal path
- Patent number 4,700,273
- Issue date Oct 13, 1987
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package with external circuit board and connection
- Patent number 4,630,174
- Issue date Dec 16, 1986
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting a compact circuit package to a heat sink or the...
- Patent number 4,577,387
- Issue date Mar 25, 1986
- Lance R. Kaufman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact circuit package with improved construction for clamping to...
- Patent number 4,574,162
- Issue date Mar 4, 1986
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple substrate circuit package
- Patent number 4,554,613
- Issue date Nov 19, 1985
- Lance R. Kaufman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit package with membrane, containing thermoconductive material...
- Patent number 4,546,410
- Issue date Oct 8, 1985
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting of a compact circuit package to a heat sink or the like
- Patent number 4,546,411
- Issue date Oct 8, 1985
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical sub-assembly having a lead frame to be compressed betwee...
- Patent number 4,498,120
- Issue date Feb 5, 1985
- Lance R. Kaufman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame connector for compact circuit package
- Patent number 4,488,202
- Issue date Dec 11, 1984
- Lance R. Kaufman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of clamping a circuit package to enhance heat transfer
- Patent number 4,449,292
- Issue date May 22, 1984
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact circuit package having an improved lead frame connector
- Patent number 4,449,165
- Issue date May 15, 1984
- Lance R. Kaufman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power switching device having improved heat dissipation means
- Patent number 4,394,530
- Issue date Jul 19, 1983
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positioning means for optically couplable circuit elements
- Patent number 4,266,140
- Issue date May 5, 1981
- Lance R. Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical power converter thyristor firing circuit having noise im...
- Patent number 4,257,091
- Issue date Mar 17, 1981
- Lance R. Kaufman
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Broadcast system
- Publication number 20010032336
- Publication date Oct 18, 2001
- Jason Kaufman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PREFERENCE BASED TELECOMMUNICATION INFORMATION SERVICE
- Publication number 20010012335
- Publication date Aug 9, 2001
- LANCE KAUFMAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

LANCE KAUFMAN

Person

Patents Grantslast 30 patents

Method of making a circuit assembly

Electric circuit assembly with voltage isolation

Circuit assembly and method with direct bonded terminal pin

Current sense circuit

Direct bond circuit assembly with crimped lead frame

Bolted circuit assembly with isolating washer

Hermetic direct bond circuit assembly

Direct bond circuit assembly with ground plane

Heat sink apparatus with electrically insulative intermediate condu...

Direct bond circuit assembly with crimped lead frame

Direct current sense lead

Isolated package for multiple semiconductor power components

Method of making circuit assembly with hardened direct bond lead frame

Circuit package with thermal expansion relief chimney

Low cost compressively clamped circuit and heat sink assembly

Isolation transformer

Circuit assembly with semiconductor expansion matched thermal path

Circuit package with external circuit board and connection

Method of mounting a compact circuit package to a heat sink or the...

Compact circuit package with improved construction for clamping to...

Multiple substrate circuit package

Circuit package with membrane, containing thermoconductive material...

Mounting of a compact circuit package to a heat sink or the like

Electrical sub-assembly having a lead frame to be compressed betwee...

Lead frame connector for compact circuit package

Method of clamping a circuit package to enhance heat transfer

Compact circuit package having an improved lead frame connector

Power switching device having improved heat dissipation means

Positioning means for optically couplable circuit elements

Electrical power converter thyristor firing circuit having noise im...

Patents Applicationslast 30 patents

Broadcast system

PREFERENCE BASED TELECOMMUNICATION INFORMATION SERVICE