Larg Weiland

Person

Hollister, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,107,804
- Issue date Aug 31, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G01 - MEASURING TESTING
Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,081,476
- Issue date Aug 3, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,081,477
- Issue date Aug 3, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC with test structures and E-beam pads embedded within a contiguou...
- Patent number 11,075,194
- Issue date Jul 27, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,018,126
- Issue date May 25, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G01 - MEASURING TESTING
Information Patent Grant
IC with test structures and E-beam pads embedded within a contiguou...
- Patent number 10,978,438
- Issue date Apr 13, 2021
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,854,522
- Issue date Dec 1, 2020
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC with test structures embedded within a contiguous standard cell...
- Patent number 10,777,472
- Issue date Sep 15, 2020
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making semiconductor dies, chips, and wafers using in-l...
- Patent number 10,593,604
- Issue date Mar 17, 2020
- PDF Solutions, Inc.
- Stephen Lam
- G01 - MEASURING TESTING
Information Patent Grant
Methods for processing a semiconductor wafer using non-contact elec...
- Patent number 10,290,552
- Issue date May 14, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit containing first and second DOEs of standard Cel...
- Patent number 10,269,786
- Issue date Apr 23, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,211,112
- Issue date Feb 19, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,211,111
- Issue date Feb 19, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,290
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,284
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,285
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,288
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor water using non-contact elect...
- Patent number 10,199,293
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wager using non-contact elect...
- Patent number 10,199,283
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,287
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,294
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,286
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,289
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including NCEM-enabled, tip-to-side gap-configur...
- Patent number 10,109,539
- Issue date Oct 23, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for making and using a semiconductor wafer containing first...
- Patent number 10,096,529
- Issue date Oct 9, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for making and using a semiconductor wafer containing first...
- Patent number 10,096,530
- Issue date Oct 9, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit containing DOEs of GATECNT-tip-to-side-short-con...
- Patent number 9,984,944
- Issue date May 29, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for making semiconductor dies, chips, and wafers using non-...
- Patent number 9,953,889
- Issue date Apr 24, 2018
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including NCEM-enabled, side-to-side gap-configu...
- Patent number 9,947,601
- Issue date Apr 17, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for making an integrated circuit that includes NCEM-Enabled...
- Patent number 9,929,063
- Issue date Mar 27, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Containing DOEs of NCEM-enabled Fill Cells
- Publication number 20170178981
- Publication date Jun 22, 2017
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System And Method For Product Yield Prediction
- Publication number 20080282210
- Publication date Nov 13, 2008
- PDF Solutions, Inc.
- Brian E. Stine
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Layout compiler
- Publication number 20070268731
- Publication date Nov 22, 2007
- PDF Solutions, Inc.
- Larg H. Weiland
- G01 - MEASURING TESTING
Information Patent Application
System and method for product yield prediction
- Publication number 20070118242
- Publication date May 24, 2007
- PDF Solutions, Inc.
- Brian E. Stine
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and method for product yield prediction
- Publication number 20060277506
- Publication date Dec 7, 2006
- PDF Solutions, Inc.
- Brian E. Stine
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Fast localization of electrical failures on an integrated circuit s...
- Publication number 20060105475
- Publication date May 18, 2006
- Dennis Ciplickas
- G01 - MEASURING TESTING
Information Patent Application
System and method for product yield prediction
- Publication number 20050158888
- Publication date Jul 21, 2005
- PDF Solutions, Inc.
- Brian E. Stine
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Zoom in pin nest structure, test vehicle having the structure, and...
- Publication number 20050122123
- Publication date Jun 9, 2005
- Brian E. Stine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test structures for estimating dishing and erosion effects in coppe...
- Publication number 20040232910
- Publication date Nov 25, 2004
- Dennis J Ciplickas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extraction method of defect density and size distributions
- Publication number 20040094762
- Publication date May 20, 2004
- Christopher Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for product yield prediction
- Publication number 20030145292
- Publication date Jul 31, 2003
- Brian E. Stine
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Test vehicle with zig-zag structures
- Publication number 20030020503
- Publication date Jan 30, 2003
- Larg H. Weiland
- G01 - MEASURING TESTING

Larg Weiland

Person

Patents Grantslast 30 patents

IC with test structures and e-beam pads embedded within a contiguou...

IC with test structures and e-beam pads embedded within a contiguou...

IC with test structures and e-beam pads embedded within a contiguou...

IC with test structures and E-beam pads embedded within a contiguou...

IC with test structures and e-beam pads embedded within a contiguou...

IC with test structures and E-beam pads embedded within a contiguou...

Method for processing a semiconductor wafer using non-contact elect...

IC with test structures embedded within a contiguous standard cell...

Process for making semiconductor dies, chips, and wafers using in-l...

Methods for processing a semiconductor wafer using non-contact elec...

Integrated circuit containing first and second DOEs of standard Cel...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor water using non-contact elect...

Method for processing a semiconductor wager using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Integrated circuit including NCEM-enabled, tip-to-side gap-configur...

Process for making and using a semiconductor wafer containing first...

Process for making and using a semiconductor wafer containing first...

Integrated circuit containing DOEs of GATECNT-tip-to-side-short-con...

Process for making semiconductor dies, chips, and wafers using non-...

Integrated circuit including NCEM-enabled, side-to-side gap-configu...

Process for making an integrated circuit that includes NCEM-Enabled...

Patents Applicationslast 30 patents

Integrated Circuit Containing DOEs of NCEM-enabled Fill Cells

System And Method For Product Yield Prediction

Layout compiler

System and method for product yield prediction

System and method for product yield prediction

Fast localization of electrical failures on an integrated circuit s...

System and method for product yield prediction

Zoom in pin nest structure, test vehicle having the structure, and...

Test structures for estimating dishing and erosion effects in coppe...

Extraction method of defect density and size distributions

System and method for product yield prediction

Test vehicle with zig-zag structures