Larry Buffle

Person

Caen, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Trench capacitor structure with hybrid filling layer
- Patent number 11,955,568
- Issue date Apr 9, 2024
- Murata Manufacturing Co., Ltd.
- Larry Buffle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL DEVICE COMPRISING A MONOLITHIC DIAMOND REGION COMPRISING...
- Publication number 20240274654
- Publication date Aug 15, 2024
- Murata Manufacturing Co., Ltd.
- Larry BUFFLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR STRUCTURE WITH HYBRID FILLING LAYER
- Publication number 20240213377
- Publication date Jun 27, 2024
- Murata Manufacturing Co., Ltd.
- Larry BUFFLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICE FOR HIGH-VOLTAGE APPLICATIONS
- Publication number 20240162280
- Publication date May 16, 2024
- Murata Manufacturing Co., Ltd.
- Larry BUFFLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AN ELECTRICAL DEVICE COMPRISING A CAPACITOR WHEREIN THE DIELECTRIC...
- Publication number 20230245834
- Publication date Aug 3, 2023
- Murata Manufacturing Co., Ltd.
- Larry BUFFLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT COMPRISING A 3D CAPACITIVE STRUCTURE
- Publication number 20230134193
- Publication date May 4, 2023
- Murata Manufacturing Co., Ltd.
- Larry BUFFLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH SELECTIVE BOTTOM TERMINAL CONTACTING
- Publication number 20230125974
- Publication date Apr 27, 2023
- Murata Manufacturing Co., Ltd.
- Julien EL SABAHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR STRUCTURE WITH HYBRID FILLING LAYER
- Publication number 20220393038
- Publication date Dec 8, 2022
- Murata Manufacturing Co., Ltd.
- Larry BUFFLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH CRACK-BLOCKING THREE-DIMENSIONAL STRUC...
- Publication number 20220392852
- Publication date Dec 8, 2022
- Murata Manufacturing Co., Ltd.
- Frédéric Voiron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED RC ARCHITECTURE, AND METHODS OF FABRICATION THEREOF
- Publication number 20210327867
- Publication date Oct 21, 2021
- Murata Manufacturing Co., Ltd.
- Stéphane Bouvier
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR STRUCTURE ENHANCED FOR HIGH VOLTAGE APPLICATIONS
- Publication number 20210091174
- Publication date Mar 25, 2021
- Murata Manufacturing Co., Ltd.
- Frédéric Voiron
- H01 - BASIC ELECTRIC ELEMENTS

Larry Buffle

Person

Patents Grantslast 30 patents

Trench capacitor structure with hybrid filling layer

Patents Applicationslast 30 patents

ELECTRICAL DEVICE COMPRISING A MONOLITHIC DIAMOND REGION COMPRISING...

TRENCH CAPACITOR STRUCTURE WITH HYBRID FILLING LAYER

ELECTRICAL DEVICE FOR HIGH-VOLTAGE APPLICATIONS

AN ELECTRICAL DEVICE COMPRISING A CAPACITOR WHEREIN THE DIELECTRIC...

ELECTRONIC COMPONENT COMPRISING A 3D CAPACITIVE STRUCTURE

SEMICONDUCTOR STRUCTURE WITH SELECTIVE BOTTOM TERMINAL CONTACTING

TRENCH CAPACITOR STRUCTURE WITH HYBRID FILLING LAYER

SEMICONDUCTOR STRUCTURE WITH CRACK-BLOCKING THREE-DIMENSIONAL STRUC...

INTEGRATED RC ARCHITECTURE, AND METHODS OF FABRICATION THEREOF

SEMICONDUCTOR STRUCTURE ENHANCED FOR HIGH VOLTAGE APPLICATIONS