Larry Leighton

Person

Santa Cruz, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bond wire tuning of RF power transistors and amplifiers
- Patent number 6,806,106
- Issue date Oct 19, 2004
- Infineon Technologies AG
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple ground signal path LDMOS power package
- Patent number 6,777,791
- Issue date Aug 17, 2004
- Infineon Technologies AG
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF power transistor with internal bias feed
- Patent number 6,734,728
- Issue date May 11, 2004
- Infineon Technologies North America Corp.
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stage, high frequency, high power signal amplifier
- Patent number 6,614,308
- Issue date Sep 2, 2003
- Infineon Technologies AG
- Thomas W. Moller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stability enhanced multistage power amplifier
- Patent number 6,583,673
- Issue date Jun 24, 2003
- Infineon Technologies AG
- Bengt Ahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gain and bandwidth enhancement for RF power amplifier package
- Patent number 6,466,094
- Issue date Oct 15, 2002
- Ericsson Inc.
- Larry C. Leighton
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Single chip push-pull power transistor device
- Patent number 6,455,905
- Issue date Sep 24, 2002
- Ericsson Inc.
- Prasanth Perugupalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional lid for RF power package
- Patent number 6,392,298
- Issue date May 21, 2002
- Ericsson Inc.
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical bipolar transistor having a field shield between the metal...
- Patent number 6,239,475
- Issue date May 29, 2001
- Telefonaktiebolaget LM Ericsson (publ)
- Ted Johansson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive mounting arrangement for securing an integrate...
- Patent number 6,181,006
- Issue date Jan 30, 2001
- Ericsson Inc.
- Bengt Ahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive mounting arrangement for securing an integrated circuit...
- Patent number 6,160,710
- Issue date Dec 12, 2000
- Ericsson Inc.
- Bengt Ahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing vertical bipolar transistor having a field...
- Patent number 6,077,753
- Issue date Jun 20, 2000
- Telefonaktiebolaget LM Ericsson
- Ted Johansson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive interconnect of transistor cells
- Patent number 5,982,000
- Issue date Nov 9, 1999
- Ericsson Inc.
- Larry C. Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond attachment of a integrated circuit package to a heat sink
- Patent number 5,933,327
- Issue date Aug 3, 1999
- Ericsson, Inc.
- Larry C. Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ballast monitoring for radio frequency power transistors
- Patent number 5,907,180
- Issue date May 25, 1999
- Telefonaktiebolaget LM Ericsson
- Ted Johansson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF power package with a dual ground
- Patent number 5,889,319
- Issue date Mar 30, 1999
- Ericsson, Inc.
- Thomas W. Moller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct contact die attach
- Patent number 5,877,555
- Issue date Mar 2, 1999
- Ericsson, Inc.
- Larry C. Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting arrangement for securing an intergrated circuit package to...
- Patent number 5,869,897
- Issue date Feb 9, 1999
- Ericcson, Inc.
- Larry C. Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally balanced radio frequency power transistor
- Patent number 5,804,867
- Issue date Sep 8, 1998
- Ericsson Inc.
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Emitter ballast bypass for radio frequency power transistors
- Patent number 5,684,326
- Issue date Nov 4, 1997
- Telefonaktiebolaget LM Ericsson
- Ted Johansson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout for radio frequency power transistors
- Patent number 5,488,252
- Issue date Jan 30, 1996
- Telefonaktiebolaget L M Erricsson
- Ted Johansson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-stage, high frequency, high power signal amplifier
- Publication number 20030076173
- Publication date Apr 24, 2003
- Telefonaktiebolaget LM Ericsson
- Thomas W. Moller
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Tunable impedance matching circuit for RF power amplifier
- Publication number 20030030504
- Publication date Feb 13, 2003
- Telefonaktiebolaget LM Ericsson
- Nagaraj Dixit
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SINGLE CHIP PUSH-PULL POWER TRANSISTOR DEVICE
- Publication number 20020145184
- Publication date Oct 10, 2002
- Ericsson Inc.
- Prasanth Perugupalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple ground signal path LDMOS power package
- Publication number 20020140071
- Publication date Oct 3, 2002
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond wire tuning of RF power transistors and amplifiers
- Publication number 20020134993
- Publication date Sep 26, 2002
- Ericsson Inc.
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gain and bandwidth enhancement for RF power amplifier package
- Publication number 20020125955
- Publication date Sep 12, 2002
- Ericsson Inc.
- Larry C. Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stability enhanced multistage power amplifier
- Publication number 20020118068
- Publication date Aug 29, 2002
- Ericsson Inc.
- Bengt Ahl
- H01 - BASIC ELECTRIC ELEMENTS

Larry Leighton

Person

Patents Grantslast 30 patents

Bond wire tuning of RF power transistors and amplifiers

Multiple ground signal path LDMOS power package

RF power transistor with internal bias feed

Multi-stage, high frequency, high power signal amplifier

Stability enhanced multistage power amplifier

Gain and bandwidth enhancement for RF power amplifier package

Single chip push-pull power transistor device

Functional lid for RF power package

Vertical bipolar transistor having a field shield between the metal...

Thermally conductive mounting arrangement for securing an integrate...

Capacitive mounting arrangement for securing an integrated circuit...

Method for manufacturing vertical bipolar transistor having a field...

Resistive interconnect of transistor cells

Wire bond attachment of a integrated circuit package to a heat sink

Ballast monitoring for radio frequency power transistors

RF power package with a dual ground

Direct contact die attach

Mounting arrangement for securing an intergrated circuit package to...

Thermally balanced radio frequency power transistor

Emitter ballast bypass for radio frequency power transistors

Layout for radio frequency power transistors

Patents Applicationslast 30 patents

Multi-stage, high frequency, high power signal amplifier

Tunable impedance matching circuit for RF power amplifier

SINGLE CHIP PUSH-PULL POWER TRANSISTOR DEVICE

Multiple ground signal path LDMOS power package

Bond wire tuning of RF power transistors and amplifiers

Gain and bandwidth enhancement for RF power amplifier package

Stability enhanced multistage power amplifier