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Larry M Mandel
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Noblesville, IN, US
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Patents Grants
last 30 patents
Information
Patent Grant
Wrap-around overmold for electronic assembly
Patent number
7,616,448
Issue date
Nov 10, 2009
Delphi Technologies, Inc.
Thomas A. Degenkolb
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Overmolded electronic assembly
Patent number
7,462,077
Issue date
Dec 9, 2008
Delphi Technologies, Inc.
Kin Yean Chow
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic assembly having a substrate laminated within a backplate...
Patent number
7,416,011
Issue date
Aug 26, 2008
Delphi Technologies, Inc.
Larry M Mandel
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip heat sink package and method
Patent number
7,352,585
Issue date
Apr 1, 2008
Delphi Technologies, Inc.
Larry M Mandel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Overmolded electronic assembly with insert molded heat sinks
Patent number
7,230,829
Issue date
Jun 12, 2007
Delphi Technologies, Inc.
Larry M Mandel
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip heat sink package and method
Patent number
7,180,745
Issue date
Feb 20, 2007
Delphi Technologies, Inc.
Larry M Mandel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Technique for connector to printed circuit board decoupling to elim...
Patent number
6,905,349
Issue date
Jun 14, 2005
Delphi Technologies, Inc.
Scott D. Brandenburg
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic assembly for removing heat from a flip chip
Patent number
6,700,195
Issue date
Mar 2, 2004
Delphi Technologies, Inc.
Larry M Mandel
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Interlocking overmold for electronic assembly
Publication number
20090197478
Publication date
Aug 6, 2009
Larry M. Mandel
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wrap-around overmold for electronic assembly
Publication number
20090073663
Publication date
Mar 19, 2009
Thomas A. Degenkolb
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Overmolded electronic assembly
Publication number
20080124987
Publication date
May 29, 2008
Kin Yean Chow
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Flip chip heat sink package and method
Publication number
20070064399
Publication date
Mar 22, 2007
DELPHI TECHNOLOGIES, INC.
Larry M. Mandel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Overmolded electronic assembly with insert molded heat sinks
Publication number
20060171120
Publication date
Aug 3, 2006
Larry M. Mandel
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic assembly having a substrate laminated within a backplate...
Publication number
20060164818
Publication date
Jul 27, 2006
Larry M. Mandel
B30 - PRESSES
Information
Patent Application
Circuit board surface mount package
Publication number
20050173152
Publication date
Aug 11, 2005
Scott E. Post
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Flip chip heat sink package and method
Publication number
20050078456
Publication date
Apr 14, 2005
Larry M. Mandel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device heat sink package and method
Publication number
20050077614
Publication date
Apr 14, 2005
Suresh K. Chengalva
H01 - BASIC ELECTRIC ELEMENTS