Lars Böwer

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Dortmund, DE

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Patents Grantslast 30 patents

Information Patent Grant
Pre-sintered semiconductor die structure
- Patent number 8,835,299
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE
- Publication number 20250062175
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Sintered Semiconductor Die Structure
- Publication number 20140061909
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS