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Lars D. Skoglund
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
Patent number
11,854,945
Issue date
Dec 26, 2023
Tahoe Research, LTD.
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
Patent number
10,192,810
Issue date
Jan 29, 2019
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
Patent number
9,859,248
Issue date
Jan 2, 2018
Intel Corporation
Danish Faruqui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ablation method and recipe for wafer level underfill material patte...
Patent number
9,786,517
Issue date
Oct 10, 2017
Intel Corporation
Rajendra C. Dias
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic die having chamfered corners
Patent number
9,508,660
Issue date
Nov 29, 2016
Intel Corporation
Manish Dubey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
Patent number
9,412,702
Issue date
Aug 9, 2016
Intel Corporation
Danish Faruqui
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
UNDERFILL MATERIAL FLOW CONTROL FOR REDUCED DIE-TO-DIE SPACING IN S...
Publication number
20190148268
Publication date
May 16, 2019
Intel Corporation
Omkar G. KARHADE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Inflatable Bladder Based Mechanical Testing for Stretchable Electro...
Publication number
20170269017
Publication date
Sep 21, 2017
Intel Corporation
Steven A. KLEIN
G01 - MEASURING TESTING
Information
Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
Publication number
20160307869
Publication date
Oct 20, 2016
Intel Corporation
Danish Faruqui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DIE HAVING CHAMFERED CORNERS
Publication number
20160233175
Publication date
Aug 11, 2016
Intel Corporation
Manish Dubey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...
Publication number
20150072479
Publication date
Mar 12, 2015
Rajendra C. Dias
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...
Publication number
20150072515
Publication date
Mar 12, 2015
Rajendra C. Dias
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDERFILL MATERIAL FLOW CONTROL FOR REDUCED DIE-TO-DIE SPACING IN S...
Publication number
20150001717
Publication date
Jan 1, 2015
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
Publication number
20140264951
Publication date
Sep 18, 2014
Danish Faruqui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Variable depth microchannels
Publication number
20080073061
Publication date
Mar 27, 2008
Rajen Dias
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic assembly having a die with rounded corner edge portions...
Publication number
20050017371
Publication date
Jan 27, 2005
Zhiyong Wang
H01 - BASIC ELECTRIC ELEMENTS