Lars Kohlmann

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Imidazoyl urea polymers and their use in metal or metal alloy plati...
- Patent number 11,066,553
- Issue date Jul 20, 2021
- Atotech Deutschland GmbH
- Heiko Brunner
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Pyridinium compounds, a synthesis method therefor, metal or metal a...
- Patent number 10,882,842
- Issue date Jan 5, 2021
- Atotech Deutschland GmbH
- Rangarajan Jagannathan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Aqueous copper plating baths and a method for deposition of copper...
- Patent number 10,767,275
- Issue date Sep 8, 2020
- Atotech Deutschland GmbH
- Heiko Brunner
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Plating bath compositions for electroless plating of metals and met...
- Patent number 9,909,216
- Issue date Mar 6, 2018
- Atotech Deutschland GmbH
- Heiko Brunner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electr...
- Patent number 9,790,607
- Issue date Oct 17, 2017
- Atotech Deutschland GmbH
- Klaus-Dieter Schulz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Galvanic nickel electroplating bath for depositing a semi-bright ni...
- Patent number 9,752,244
- Issue date Sep 5, 2017
- Atotech Deutschland GmbH
- Klaus-Dieter Schulz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper plating bath composition
- Patent number 9,551,080
- Issue date Jan 24, 2017
- Atotech Deutschland GmbH
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Pyrophosphate-containing bath for cyanide-free deposition of copper...
- Patent number 9,399,824
- Issue date Jul 26, 2016
- Atotech Deutschland GmbH
- Philip Hartmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Polymers having terminal amino groups and use thereof as additives...
- Patent number 9,322,107
- Issue date Apr 26, 2016
- Atotech Deutschland GmbH
- Heiko Brunner
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Pyrophosphate-based bath for plating of tin alloy layers
- Patent number 8,647,491
- Issue date Feb 11, 2014
- Atotech Deutschland GmbH
- Philip Hartmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
PYRIDINIUM COMPOUNDS, A SYNTHESIS METHOD THEREFOR, METAL OR METAL A...
- Publication number 20200231565
- Publication date Jul 23, 2020
- Atotech Deutschland GmbH
- Rangarajan JAGANNATHAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
IMIDAZOYL UREA POLYMERS AND THEIR USE IN METAL OR METAL ALLOY PLATI...
- Publication number 20190144667
- Publication date May 16, 2019
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
AQUEOUS COPPER PLATING BATHS AND A METHOD FOR DEPOSITION OF COPPER...
- Publication number 20180223442
- Publication date Aug 9, 2018
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING BATH COMPOSITIONS FOR ELECTROLESS PLATING OF METALS AND MET...
- Publication number 20170327954
- Publication date Nov 16, 2017
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GALVANIC NICKEL OR NICKEL ALLOY ELECTROPLATING BATH FOR DEPOSITING...
- Publication number 20160053395
- Publication date Feb 25, 2016
- Atotech Deutschland GmbH
- Klaus-Dieter SCHULZ
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER PLATING BATH COMPOSITION
- Publication number 20150299883
- Publication date Oct 22, 2015
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER...
- Publication number 20140124376
- Publication date May 8, 2014
- Atotech Deutschland GmbH
- Philip Hartmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POLYMERS HAVING TERMINAL AMINO GROUPS AND USE THEREOF AS ADDITIVES...
- Publication number 20120160698
- Publication date Jun 28, 2012
- Atotech Deutschland GmbH
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER...
- Publication number 20100326838
- Publication date Dec 30, 2010
- Atotech Deutschland GmbH
- Philip Hartmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PYROPHOSPHATE-BASED BATH FOR PLATING OF TIN ALLOY LAYERS
- Publication number 20100300890
- Publication date Dec 2, 2010
- Atotech Deutschland GmbH
- Philip Hartmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Aqueous,alkaline,cyanide-free bath for the galvanic deposition of z...
- Publication number 20100236936
- Publication date Sep 23, 2010
- Atotech Deutschland GmbH
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Aqueous, alkaline, cyanide-free bath for the galvanic deposition of...
- Publication number 20100155257
- Publication date Jun 24, 2010
- Atotech Deutschland GmbH
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Lars Kohlmann

Person

Patents Grantslast 30 patents

Imidazoyl urea polymers and their use in metal or metal alloy plati...

Pyridinium compounds, a synthesis method therefor, metal or metal a...

Aqueous copper plating baths and a method for deposition of copper...

Plating bath compositions for electroless plating of metals and met...

3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electr...

Galvanic nickel electroplating bath for depositing a semi-bright ni...

Copper plating bath composition

Pyrophosphate-containing bath for cyanide-free deposition of copper...

Polymers having terminal amino groups and use thereof as additives...

Pyrophosphate-based bath for plating of tin alloy layers

Patents Applicationslast 30 patents

PYRIDINIUM COMPOUNDS, A SYNTHESIS METHOD THEREFOR, METAL OR METAL A...

IMIDAZOYL UREA POLYMERS AND THEIR USE IN METAL OR METAL ALLOY PLATI...

AQUEOUS COPPER PLATING BATHS AND A METHOD FOR DEPOSITION OF COPPER...

PLATING BATH COMPOSITIONS FOR ELECTROLESS PLATING OF METALS AND MET...

GALVANIC NICKEL OR NICKEL ALLOY ELECTROPLATING BATH FOR DEPOSITING...

COPPER PLATING BATH COMPOSITION

PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER...

POLYMERS HAVING TERMINAL AMINO GROUPS AND USE THEREOF AS ADDITIVES...

PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER...

PYROPHOSPHATE-BASED BATH FOR PLATING OF TIN ALLOY LAYERS

Aqueous,alkaline,cyanide-free bath for the galvanic deposition of z...

Aqueous, alkaline, cyanide-free bath for the galvanic deposition of...