Lars Tilly

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Malmo, SE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductive chip having a bond pad located on an active device
- Patent number 7,060,525
- Issue date Jun 13, 2006
- Telefonaktiebolaget L M Ericsson (Publ)
- Lars Tilly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for emitter partitioning for SiGe RF power transi...
- Patent number 6,503,809
- Issue date Jan 7, 2003
- Telefonaktiebolaget LM Ericsson (publ)
- Lars Tilly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductive chip having a bond pad located on an active device
- Patent number 6,297,562
- Issue date Oct 2, 2001
- Telefonaktieboalget LM Ericsson (publ)
- Lars Tilly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for emitter partitioning for SiGe RF power transi...
- Patent number 6,236,072
- Issue date May 22, 2001
- Telefonaktiebolaget LM Ericsson (publ)
- Lars Tilly
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and system for emitter partitioning for SiGe RF power transi...
- Publication number 20010009794
- Publication date Jul 26, 2001
- Lars Tilly
- H01 - BASIC ELECTRIC ELEMENTS