Laszlo Nobi

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Fort Collins, CO, US

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Patents Grantslast 30 patents

Information Patent Grant
Support assembly for an integrated circuit package having solder co...
- Patent number 6,791,184
- Issue date Sep 14, 2004
- Hewlett-Packard Development Company, L.P.
- Jeffrey L Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a modular integrated apparatus for heat dissipation
- Patent number 6,330,745
- Issue date Dec 18, 2001
- Hewlett-Packard Company
- S. Daniel Cromwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a modular integrated apparatus for heat di...
- Patent number 6,061,235
- Issue date May 9, 2000
- Hewlett-Packard Company
- S. Daniel Cromwell
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Use of perimeter stops to support solder interconnects between inte...
- Publication number 20040134680
- Publication date Jul 15, 2004
- Xiang Dai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Support assembly for an integrated circuit package having solder co...
- Publication number 20040017006
- Publication date Jan 29, 2004
- Jeffrey L. Deeney
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...