Lau Teck Beng

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Petaling Jaya, MY

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Patents Grantslast 30 patents

Information Patent Grant
Stacked die sensor package
- Patent number 9,134,193
- Issue date Sep 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
STACKED DIE SENSOR PACKAGE
- Publication number 20150160087
- Publication date Jun 11, 2015
- Chee Seng Foong
- B60 - VEHICLES IN GENERAL
Information Patent Application
SIDE VENTED PRESSURE SENSOR DEVICE
- Publication number 20150076630
- Publication date Mar 19, 2015
- Boon Yew Low
- B81 - MICRO-STRUCTURAL TECHNOLOGY