Laure M. Maquet

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Ettelbruck, LU

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Patents Grantslast 30 patents

Information Patent Grant
Low profile copper foil and process and apparatus for making bondab...
- Patent number 5,215,646
- Issue date Jun 1, 1993
- Circuit Foil USA, Inc.
- Adam M. Wolski
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR