Lauren A. Link

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,881,463
- Issue date Jan 23, 2024
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,862,552
- Issue date Jan 2, 2024
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with reduced interconnect stress
- Patent number 11,824,013
- Issue date Nov 21, 2023
- Intel Corporation
- Lauren A. Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for package substrates
- Patent number 11,705,389
- Issue date Jul 18, 2023
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning of thin film capacitors in organic substrate packages
- Patent number 11,651,902
- Issue date May 16, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Release layer-assisted selective embedding of magnetic material in...
- Patent number 11,610,706
- Issue date Mar 21, 2023
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric cored integrated circuit package supports
- Patent number 11,552,008
- Issue date Jan 10, 2023
- Intel Corporation
- Lauren Ashley Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic structures in integrated circuit packages
- Patent number 11,444,042
- Issue date Sep 13, 2022
- Intel Corporation
- Andrew James Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor structures for package devices
- Patent number 11,335,632
- Issue date May 17, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded magnetic material using photo...
- Patent number 11,289,263
- Issue date Mar 29, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,251,113
- Issue date Feb 15, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,205,626
- Issue date Dec 21, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded dielectric magnetic material...
- Patent number 11,189,409
- Issue date Nov 30, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having polymer-derived ceramic core
- Patent number 11,075,130
- Issue date Jul 27, 2021
- Intel Corporation
- Lisa Ying Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated through hole socketing coupled to a solder ball to engage wi...
- Patent number 10,741,947
- Issue date Aug 11, 2020
- Intel Corporation
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 10,700,021
- Issue date Jun 30, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Degradable polycarbonate sport fishing materials
- Patent number 10,329,381
- Issue date Jun 25, 2019
- The Texas A&M University System
- Karen L. Wooley
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES
- Publication number 20220230951
- Publication date Jul 21, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES
- Publication number 20220130748
- Publication date Apr 28, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20220068847
- Publication date Mar 3, 2022
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL...
- Publication number 20220013265
- Publication date Jan 13, 2022
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING PHOTOIMAGEABLE DIELECTRIC (PID) FOR...
- Publication number 20210134727
- Publication date May 6, 2021
- Robert A. May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH REDUCED INTERCONNECT STRESS
- Publication number 20210050306
- Publication date Feb 18, 2021
- Intel Corporation
- Lauren A. Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR AN ELECTRONIC DEVICE
- Publication number 20200411413
- Publication date Dec 31, 2020
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS FOR PACKAGE SUBSTRATES
- Publication number 20200395282
- Publication date Dec 17, 2020
- Intel Corporation
- Andrew J. BROWN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20200279819
- Publication date Sep 3, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20200168536
- Publication date May 28, 2020
- Intel Corporation
- Lauren Ashley Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20200075511
- Publication date Mar 5, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY REGION WITH CERAMIC OR BORON FIBER
- Publication number 20200006211
- Publication date Jan 2, 2020
- Intel Corporation
- Andrew J. BROWN
- B32 - LAYERED PRODUCTS
Information Patent Application
PATTERNING OF THIN FILM CAPACITORS IN ORGANIC SUBSTRATE PACKAGES
- Publication number 20200006005
- Publication date Jan 2, 2020
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING POLYMER-DERIVED CERAMIC CORE
- Publication number 20190393109
- Publication date Dec 26, 2019
- Intel Corporation
- Lisa Ying Ying CHEN
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20190371744
- Publication date Dec 5, 2019
- Intel Corporation
- Andrew James Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASE LAYER-ASSISTED SELECTIVE EMBEDDING OF MAGNETIC MATERIAL IN...
- Publication number 20190221345
- Publication date Jul 18, 2019
- Intel Corporation
- Sai Vadlamani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PLATED THROUGH HOLE SOCKETING
- Publication number 20190214751
- Publication date Jul 11, 2019
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL...
- Publication number 20190206597
- Publication date Jul 4, 2019
- Intel Corporation
- Andrew J. Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES
- Publication number 20190206780
- Publication date Jul 4, 2019
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED MAGNETIC MATERIAL USING PHOTO...
- Publication number 20190198228
- Publication date Jun 27, 2019
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES
- Publication number 20190198436
- Publication date Jun 27, 2019
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEGRADABLE POLYCARBONATE SPORT FISHING MATERIALS
- Publication number 20180016390
- Publication date Jan 18, 2018
- Karen L. Wooley
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...

Lauren A. Link

Person

Patents Grantslast 30 patents

Coreless organic packages with embedded die and magnetic inductor s...

Methods of embedding magnetic structures in substrates

Package substrate with reduced interconnect stress

Vias for package substrates

Patterning of thin film capacitors in organic substrate packages

Release layer-assisted selective embedding of magnetic material in...

Asymmetric cored integrated circuit package supports

Magnetic structures in integrated circuit packages

Magnetic inductor structures for package devices

Electronic substrates having embedded magnetic material using photo...

Methods of embedding magnetic structures in substrates

Coreless organic packages with embedded die and magnetic inductor s...

Electronic substrates having embedded dielectric magnetic material...

Package substrate having polymer-derived ceramic core

Plated through hole socketing coupled to a solder ball to engage wi...

Coreless organic packages with embedded die and magnetic inductor s...

Degradable polycarbonate sport fishing materials

Patents Applicationslast 30 patents

MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES

METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL...

PACKAGE ARCHITECTURE UTILIZING PHOTOIMAGEABLE DIELECTRIC (PID) FOR...

PACKAGE SUBSTRATE WITH REDUCED INTERCONNECT STRESS

SUBSTRATE FOR AN ELECTRONIC DEVICE

VIAS FOR PACKAGE SUBSTRATES

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

SUBSTRATE ASSEMBLY REGION WITH CERAMIC OR BORON FIBER

PATTERNING OF THIN FILM CAPACITORS IN ORGANIC SUBSTRATE PACKAGES

PACKAGE SUBSTRATE HAVING POLYMER-DERIVED CERAMIC CORE

MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGES

RELEASE LAYER-ASSISTED SELECTIVE EMBEDDING OF MAGNETIC MATERIAL IN...

PLATED THROUGH HOLE SOCKETING

ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL...

MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES

ELECTRONIC SUBSTRATES HAVING EMBEDDED MAGNETIC MATERIAL USING PHOTO...

METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES

DEGRADABLE POLYCARBONATE SPORT FISHING MATERIALS