Laurence D. Schultz

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Under-pad for chemical-mechanical planarization of semiconductor wa...
- Patent number 5,980,363
- Issue date Nov 9, 1999
- Micron Technology, Inc.
- Scott Meikle
- B24 - GRINDING POLISHING
Information Patent Grant
Under-pad for chemical-mechanical planarization of semiconductor wa...
- Patent number 5,871,392
- Issue date Feb 16, 1999
- Micron Technology, Inc.
- Scott Meikle
- B24 - GRINDING POLISHING
Information Patent Grant
Method for chemical planarization (CMP) of a semiconductor wafer to...
- Patent number 5,514,245
- Issue date May 7, 1996
- Micron Technology, Inc.
- Trung T. Doan
- C30 - CRYSTAL GROWTH
Information Patent Grant
Apparatus for planarizing semiconductor wafers, and a polishing pad...
- Patent number 5,421,769
- Issue date Jun 6, 1995
- Micron Technology, Inc.
- Laurence D. Schultz
- B24 - GRINDING POLISHING
Information Patent Grant
Method for planarizing semiconductor wafers with a non-circular pol...
- Patent number 5,234,867
- Issue date Aug 10, 1993
- Micron Technology, Inc.
- Laurence D. Schultz
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for mechanical planarization and endpoint dete...
- Patent number 5,081,796
- Issue date Jan 21, 1992
- Micron Technology, Inc.
- Laurence D. Schultz
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for endpoint detection during mechanical planarization of...
- Patent number 5,069,002
- Issue date Dec 3, 1991
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING
Information Patent Grant
Method of endpoint detection during chemical/mechanical planarizati...
- Patent number 5,036,015
- Issue date Jul 30, 1991
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING
Information Patent Grant
Method of reworking an electrical multilayer interconnect
- Patent number 5,011,580
- Issue date Apr 30, 1991
- Microelectronics and Computer Technology Corporation
- Ju-Don T. Pan
- H01 - BASIC ELECTRIC ELEMENTS

Laurence D. Schultz

Person

Patents Grantslast 30 patents

Under-pad for chemical-mechanical planarization of semiconductor wa...

Under-pad for chemical-mechanical planarization of semiconductor wa...

Method for chemical planarization (CMP) of a semiconductor wafer to...

Apparatus for planarizing semiconductor wafers, and a polishing pad...

Method for planarizing semiconductor wafers with a non-circular pol...

Method and apparatus for mechanical planarization and endpoint dete...

Apparatus for endpoint detection during mechanical planarization of...

Method of endpoint detection during chemical/mechanical planarizati...

Method of reworking an electrical multilayer interconnect