Laurent Herard

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Slanted glass edge for image sensor package
- Patent number 11,942,496
- Issue date Mar 26, 2024
- STMicroelectronics Pte Ltd
- Laurent Herard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor chip using a dummy sidewall layer
- Patent number 11,502,029
- Issue date Nov 15, 2022
- STMicroelectronics Pte Ltd
- Laurent Herard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient light sensor with light protection
- Patent number 11,193,821
- Issue date Dec 7, 2021
- STMicroelectronics Pte Ltd
- Laurent Herard
- G01 - MEASURING TESTING
Information Patent Grant
Glue bleeding prevention cap for optical sensor packages
- Patent number 10,355,146
- Issue date Jul 16, 2019
- STMicroelectronics Pte Ltd
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Grant
Overmold proximity sensor and associated methods
- Patent number 10,147,834
- Issue date Dec 4, 2018
- STMicroelectronics Pte Ltd
- Laurent Herard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glue bleeding prevention cap for optical sensor packages
- Patent number 10,038,108
- Issue date Jul 31, 2018
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making image sensors using wafer-level processing and as...
- Patent number 9,013,017
- Issue date Apr 21, 2015
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making paired lenses with an opaque barrier between, and...
- Patent number 8,937,774
- Issue date Jan 20, 2015
- STMicroelectronics Pte Ltd
- Laurent Herard
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SLANTED GLASS EDGE FOR IMAGE SENSOR PACKAGE
- Publication number 20240194709
- Publication date Jun 13, 2024
- STMicroelectronics Pte Ltd
- Laurent HERARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLANTED GLASS EDGE FOR IMAGE SENSOR PACKAGE
- Publication number 20210384241
- Publication date Dec 9, 2021
- STMicroelectronics Pte Ltd
- Laurent HERARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A THIN SEMICONDUCTOR CHIP USING A DUMMY SID...
- Publication number 20210020555
- Publication date Jan 21, 2021
- STMicroelectronics Pte Ltd
- Laurent HERARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING ELECTRONIC CHIPS
- Publication number 20190319157
- Publication date Oct 17, 2019
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMBIENT LIGHT SENSOR WITH LIGHT PROTECTION
- Publication number 20190195685
- Publication date Jun 27, 2019
- STMicroelectronics Pte Ltd
- Laurent HERARD
- G01 - MEASURING TESTING
Information Patent Application
GLUE BLEEDING PREVENTION CAP FOR OPTICAL SENSOR PACKAGES
- Publication number 20180331236
- Publication date Nov 15, 2018
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- G01 - MEASURING TESTING
Information Patent Application
GLUE BLEEDING PREVENTION CAP FOR OPTICAL SENSOR PACKAGES
- Publication number 20180062003
- Publication date Mar 1, 2018
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING AN INTEGRATED CIRCUIT (IC) PACKAGE WITH AN ELECTR...
- Publication number 20170186644
- Publication date Jun 29, 2017
- STMicroelectronics Pte Ltd
- Laurent HERARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERMOLD PROXIMITY SENSOR AND ASSOCIATED METHODS
- Publication number 20170110618
- Publication date Apr 20, 2017
- STMicroelectronics Pte Ltd
- Laurent HERARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING PAIRED LENSES WITH AN OPAQUE BARRIER BETWEEN, AND...
- Publication number 20140111875
- Publication date Apr 24, 2014
- STMicroelectronics Pte Ltd
- Laurent Herard
- G02 - OPTICS
Information Patent Application
METHOD FOR MAKING IMAGE SENSORS USING WAFER-LEVEL PROCESSING AND AS...
- Publication number 20140103476
- Publication date Apr 17, 2014
- STMicroelectronics Asia Pacific Pte. Ltd.
- Yonggang JIN
- H01 - BASIC ELECTRIC ELEMENTS

Laurent Herard

Person

Patents Grantslast 30 patents

Slanted glass edge for image sensor package

Thin semiconductor chip using a dummy sidewall layer

Ambient light sensor with light protection

Glue bleeding prevention cap for optical sensor packages

Overmold proximity sensor and associated methods

Glue bleeding prevention cap for optical sensor packages

Method for making image sensors using wafer-level processing and as...

Method for making paired lenses with an opaque barrier between, and...

Patents Applicationslast 30 patents

SLANTED GLASS EDGE FOR IMAGE SENSOR PACKAGE

SLANTED GLASS EDGE FOR IMAGE SENSOR PACKAGE

METHOD OF MANUFACTURING A THIN SEMICONDUCTOR CHIP USING A DUMMY SID...

ELECTRONIC DEVICE COMPRISING ELECTRONIC CHIPS

AMBIENT LIGHT SENSOR WITH LIGHT PROTECTION

GLUE BLEEDING PREVENTION CAP FOR OPTICAL SENSOR PACKAGES

GLUE BLEEDING PREVENTION CAP FOR OPTICAL SENSOR PACKAGES

METHOD FOR MAKING AN INTEGRATED CIRCUIT (IC) PACKAGE WITH AN ELECTR...

OVERMOLD PROXIMITY SENSOR AND ASSOCIATED METHODS

METHOD FOR MAKING PAIRED LENSES WITH AN OPAQUE BARRIER BETWEEN, AND...

METHOD FOR MAKING IMAGE SENSORS USING WAFER-LEVEL PROCESSING AND AS...