Laurent Viravaux

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Corenc, FR

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Patents Grantslast 30 patents

Information Patent Grant
Method for bonding two substrates
- Patent number 12,176,244
- Issue date Dec 24, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching substrates comprising a thin surface layer, for...
- Patent number 12,040,194
- Issue date Jul 16, 2024
- Soitec
- Laurent Viravaux
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR BONDING TWO SUBSTRATES
- Publication number 20230032336
- Publication date Feb 2, 2023
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ETCHING SUBSTRATES COMPRISING A THIN SURFACE LAYER, FOR...
- Publication number 20230011691
- Publication date Jan 12, 2023
- SOITEC
- Laurent Viravaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR TREATING AN SOI SUBSTRATE IN A SINGLE WAFER CLEANER
- Publication number 20200083065
- Publication date Mar 12, 2020
- SOITEC
- Laurent Viravaux
- H01 - BASIC ELECTRIC ELEMENTS