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Lawrence Chiang Sheu
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Hsinchu City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Solder ball protection structure with thick polymer layer
Patent number
9,905,520
Issue date
Feb 27, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming interconnects for three dimensional integrated ci...
Patent number
9,583,365
Issue date
Feb 28, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun Hui Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Recessed polysilicon gate structure for a strained silicon MOSFET d...
Patent number
7,172,933
Issue date
Feb 6, 2007
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Chun Huang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR COMPONENT WITH COOLING STRUCTURE
Publication number
20210098336
Publication date
Apr 1, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Tung-Liang Shao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Forming Interconnects for Three Dimensional Integrated Ci...
Publication number
20130313121
Publication date
Nov 28, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun Hui Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder Ball Protection Structure with Thick Polymer Layer
Publication number
20120319251
Publication date
Dec 20, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
A Recessed Polysilicon Gate Structure for a Strained Silicon MOSFET...
Publication number
20060009001
Publication date
Jan 12, 2006
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Chun Huang
H01 - BASIC ELECTRIC ELEMENTS