Lawrence Dean Dyer

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of reducing wafer particles after partial saw using a superh...
- Patent number 6,063,696
- Issue date May 16, 2000
- Texas Instruments Incorporated
- Mike Brenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing wafer particles after partial saw
- Patent number 5,817,569
- Issue date Oct 6, 1998
- Texas Instruments Incorporated
- Mike Brenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation of wafer into die with wafer-level processing
- Patent number 5,597,767
- Issue date Jan 28, 1997
- Texas Instruments Incorporated
- Michael A. Mignardi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor wafer edge polishing system and method
- Patent number 5,595,522
- Issue date Jan 21, 1997
- Texas Instruments Incorporated
- Vikki S. Simpson
- B24 - GRINDING POLISHING
Information Patent Grant
Method of surface protection of a semiconductor wafer during polishing
- Patent number 5,424,224
- Issue date Jun 13, 1995
- Texas Instruments Incorporated
- Franklin L. Allen
- B24 - GRINDING POLISHING
Information Patent Grant
Notch beveling on semiconductor wafer edges
- Patent number 5,289,661
- Issue date Mar 1, 1994
- Texas Instruments Incorporated
- Joel B. Jones
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing semiconductor wafer edges
- Patent number 5,274,959
- Issue date Jan 4, 1994
- Texas Instruments Incorporated
- Lawrence D. Dyer
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer stacking apparatus and method
- Patent number 5,240,557
- Issue date Aug 31, 1993
- Texas Instruments Incorporated
- Lawrence D. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polishing semiconductor wafer edges
- Patent number 5,128,281
- Issue date Jul 7, 1992
- Texas Instruments Incorporated
- Lawrence D. Dyer
- B24 - GRINDING POLISHING
Information Patent Grant
Iodine sterilization of deionized water in semiconductor processing
- Patent number 4,935,064
- Issue date Jun 19, 1990
- Texas Instruments Incorporated
- John B. Robbins
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Control of internal diameter saw blade tension in situ
- Patent number 4,502,459
- Issue date Mar 5, 1985
- Texas Instruments Incorporated
- Lawrence D. Dyer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Kerf loss reduction in internal diameter sawing
- Patent number 4,501,258
- Issue date Feb 26, 1985
- Texas Instruments Incorporated
- Lawrence D. Dyer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for measuring saw blade flexure
- Patent number 4,498,345
- Issue date Feb 12, 1985
- Texas Instruments Incorporated
- Lawrence D. Dyer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Dislocation-free growth of silicon semiconductor crystals with <...
- Patent number 4,002,523
- Issue date Jan 11, 1977
- Texas Instruments Incorporated
- Lawrence Dean Dyer
- C30 - CRYSTAL GROWTH

Lawrence Dean Dyer

Person

Patents Grantslast 30 patents

Method of reducing wafer particles after partial saw using a superh...

Method of reducing wafer particles after partial saw

Separation of wafer into die with wafer-level processing

Semiconductor wafer edge polishing system and method

Method of surface protection of a semiconductor wafer during polishing

Notch beveling on semiconductor wafer edges

Method for polishing semiconductor wafer edges

Semiconductor wafer stacking apparatus and method

Method for polishing semiconductor wafer edges

Iodine sterilization of deionized water in semiconductor processing

Control of internal diameter saw blade tension in situ

Kerf loss reduction in internal diameter sawing

Method for measuring saw blade flexure

Dislocation-free growth of silicon semiconductor crystals with &lt;...

Dislocation-free growth of silicon semiconductor crystals with <...