Lawrence H. Herko

Person

Palmyra, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming semiconductor structure
- Patent number 6,436,793
- Issue date Aug 20, 2002
- Xerox Corporation
- Gary A. Kneezel
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of back cutting silicon wafers during a dicing procedure
- Patent number 5,668,061
- Issue date Sep 16, 1997
- Xerox Corporation
- Lawrence H. Herko
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Layered resinoid/diamond blade for precision cutting operations and...
- Patent number 5,637,388
- Issue date Jun 10, 1997
- Xerox Corporation
- Robert M. White
- B24 - GRINDING POLISHING
Information Patent Grant
Ink jet printhead with sealed manifold and printhead die
- Patent number 5,515,089
- Issue date May 7, 1996
- Xerox Corporation
- Lawrence H. Herko
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Back side relief on thermal ink jet die assembly
- Patent number 5,506,610
- Issue date Apr 9, 1996
- Xerox Corporation
- Robert P. Altavela
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Teflon filled resinoid dicing blades for fabricating silicon die mo...
- Patent number 5,494,698
- Issue date Feb 27, 1996
- Xerox Corporation
- Robert M. White
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Two-step dieing process to form an ink jet face
- Patent number 5,408,739
- Issue date Apr 25, 1995
- Xerox Corporation
- Robert P. Altavela
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Method of reducing chipping and contamination of reservoirs and cha...
- Patent number 5,306,370
- Issue date Apr 26, 1994
- Xerox Corporation
- Lawrence H. Herko
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of forming semiconductor structure
- Publication number 20020086452
- Publication date Jul 4, 2002
- Gary A. Kneezel
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Lawrence H. Herko

Person

Patents Grantslast 30 patents

Methods of forming semiconductor structure

Method of back cutting silicon wafers during a dicing procedure

Layered resinoid/diamond blade for precision cutting operations and...

Ink jet printhead with sealed manifold and printhead die

Back side relief on thermal ink jet die assembly

Teflon filled resinoid dicing blades for fabricating silicon die mo...

Two-step dieing process to form an ink jet face

Method of reducing chipping and contamination of reservoirs and cha...

Patents Applicationslast 30 patents

Methods of forming semiconductor structure