Lawrence P. Flannery

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Warrenton, MO, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for reducing the metal content in the device layer of SOI s...
- Patent number 8,796,116
- Issue date Aug 5, 2014
- SunEdison Semiconductor Limited
- Alexis Grabbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing silicon on insulator wafers
- Patent number 8,080,464
- Issue date Dec 20, 2011
- MEMC Electronics Materials, Inc,
- Swapnil Y. Dhumal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dressing a wafer polishing pad
- Patent number 7,846,006
- Issue date Dec 7, 2010
- MEMC Electronic Materials, Inc.
- Mark G. Stinson
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for dressing a wafer polishing pad
- Patent number 7,846,007
- Issue date Dec 7, 2010
- MEMC Electronic Materials, Inc.
- Mark G. Stinson
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SOI STRUCTURES HAVING A SACRIFICIAL OXIDE LAYER
- Publication number 20130168836
- Publication date Jul 4, 2013
- MEMC Electronic Materials, Inc.
- Alexis Grabbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI STRUCTURES WITH REDUCED METAL CONTENT
- Publication number 20130168802
- Publication date Jul 4, 2013
- MEMC Electronic Materials, Inc.
- Alexis Grabbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING THE METAL CONTENT IN THE DEVICE LAYER OF SOI S...
- Publication number 20120193753
- Publication date Aug 2, 2012
- MEMC Electronic Materials, Inc.
- Alexis Grabbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods For Processing Silicon On Insulator Wafers
- Publication number 20110159668
- Publication date Jun 30, 2011
- MEMC Electronic Materials, Inc.
- Swapnil Y. Dhumal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR DRESSING A WAFER POLISHING PAD
- Publication number 20090176441
- Publication date Jul 9, 2009
- MEMC Electronic Materials, Inc.
- Mark G. Stinson
- B24 - GRINDING POLISHING
Information Patent Application
Dressing a Wafer Polishing Pad
- Publication number 20080009231
- Publication date Jan 10, 2008
- MEMC Electronic Materials, Inc.
- Mark G. Stinson
- B24 - GRINDING POLISHING