Lawrence P. Lehman

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to accommodate increase in volume expansion during solder re...
- Patent number 7,703,199
- Issue date Apr 27, 2010
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of accommodating in volume expansion during solder reflow
- Patent number 7,086,147
- Issue date Aug 8, 2006
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure to accommodate increase in volume expansion during solder...
- Patent number 6,686,664
- Issue date Feb 3, 2004
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Negative volume expansion lead-free electrical connection
- Patent number 6,649,833
- Issue date Nov 18, 2003
- International Business Machines Corporation
- David V. Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for imaging electrical contacts
- Patent number 6,639,661
- Issue date Oct 28, 2003
- International Business Machines Corporation
- William L. Brodsky
- G01 - MEASURING TESTING
Information Patent Grant
Arrangement and method for degassing small-high aspect ratio drille...
- Patent number 6,626,196
- Issue date Sep 30, 2003
- International Busines Machines Corporation
- Francis J. Downes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Removal of metal skin from a copper-Invar-copper laminate
- Patent number 6,228,246
- Issue date May 8, 2001
- International Business Machines Corporation
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anode container, electroplating system, method and plated object
- Patent number 6,190,530
- Issue date Feb 20, 2001
- International Business Machines Corporation
- William Louis Brodsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Biased acid cleaning of a copper-invar-copper laminate
- Patent number 6,179,990
- Issue date Jan 30, 2001
- International Business Machines Corporation
- Raymond Thomas Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for establishing a solder bond to a solder bal...
- Patent number 5,902,495
- Issue date May 11, 1999
- International Business Machines Corporation
- Edward J. Burke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20060208030
- Publication date Sep 21, 2006
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20040183094
- Publication date Sep 23, 2004
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement and method for degassing small-high aspect ratio drille...
- Publication number 20020189637
- Publication date Dec 19, 2002
- International Business Machines
- Francis J. Downes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20020158110
- Publication date Oct 31, 2002
- International Business Machines Corporation
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for imaging electrical contacts
- Publication number 20020089663
- Publication date Jul 11, 2002
- William L. Brodsky
- G01 - MEASURING TESTING

Lawrence P. Lehman

Person

Patents Grantslast 30 patents

Method to accommodate increase in volume expansion during solder re...

Method of accommodating in volume expansion during solder reflow

Structure to accommodate increase in volume expansion during solder...

Negative volume expansion lead-free electrical connection

Technique for imaging electrical contacts

Arrangement and method for degassing small-high aspect ratio drille...

Removal of metal skin from a copper-Invar-copper laminate

Anode container, electroplating system, method and plated object

Biased acid cleaning of a copper-invar-copper laminate

Method and apparatus for establishing a solder bond to a solder bal...

Patents Applicationslast 30 patents

Structure to accommodate increase in volume expansion during solder...

Structure to accommodate increase in volume expansion during solder...

Arrangement and method for degassing small-high aspect ratio drille...

Structure to accommodate increase in volume expansion during solder...

Technique for imaging electrical contacts