Lawrence R. Gardner

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for mounting a wafer to a submount
- Patent number 5,300,175
- Issue date Apr 5, 1994
- Motorola, Inc.
- Lawrence R. Gardner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus and method for handling fragile semiconductor wafers
- Patent number 5,273,615
- Issue date Dec 28, 1993
- Motorola, Inc.
- Paul D. Asetta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer wax mounting and thinning process
- Patent number 5,256,599
- Issue date Oct 26, 1993
- Motorola, Inc.
- Paul D. Asetta
- H01 - BASIC ELECTRIC ELEMENTS